Volume 43,
Number 1,
January 2003
- Harry A. Schafft, Linda M. Head, Jason Gill, Timothy D. Sullivan:
Early reliability assessment by using deep censoring.
1-16
Electronic Edition (link) BibTeX
- Michael W. Ruprecht, Guenther Benstetter, Douglas B. Hunt:
A review of ULSI failure analysis techniques for DRAMs. Part II: Defect isolation and visualization.
17-41
Electronic Edition (link) BibTeX
- C.-T. Wu, A. Mieckowski, R. S. Ridley, G. Dolny, T. Grebs, J. Linn, J. Ruzyllo:
Effect of nitridation on the reliability of thick gate oxides.
43-47
Electronic Edition (link) BibTeX
- Emil V. Jelenkovic, K. Y. Tong, W. Y. Cheung, S. P. Wong:
Degradation of RuO2 thin films in hydrogen atmosphere at temperatures between 150 and 250 degreeC.
49-55
Electronic Edition (link) BibTeX
- N. A. Hastas, C. A. Dimitriadis, J. Brini, G. Kamarinos, V. K. Gueorguiev, S. Kaschieva:
Effects of gamma-ray irradiation on polycrystalline silicon thin-film transistors.
57-60
Electronic Edition (link) BibTeX
- V. A. Vashchenko, A. Concannon, M. ter Beek, P. Hopper:
LVTSCR structures for latch-up free ESD protection of BiCMOS RF circuits.
61-69
Electronic Edition (link) BibTeX
- D. Trémouilles, G. Bertrand, M. Bafleur, Felix Beaudoin, Philippe Perdu, N. Guitard, L. Lescouzères:
TCAD and SPICE modeling help solve ESD protection issues in analog CMOS technology.
71-79
Electronic Edition (link) BibTeX
- P. Cova, Roberto Menozzi, M. Portesine:
Power p-i-n diodes for snubberless application: H+ irradiation for soft and reliable reverse recovery.
81-87
Electronic Edition (link) BibTeX
- S. Forster, T. Lequeu, R. Jérisian:
Degradation mechanism of power devices under di/dt thermal shocks: turn-on of a TRIAC in Q3.
89-98
Electronic Edition (link) BibTeX
- G. Romo, T. Smy, D. Walkey, B. Reid:
Modeling facet heating in ridge lasers.
99-110
Electronic Edition (link) BibTeX
- A. Cazarré, F. Lépinois, A. Marty, S. Pinel, J. Tasselli, J. P. Bailbé, J. R. Morante, F. Murray:
Electrical qualification of new ultrathin integration techniques.
111-115
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- M. Karilahti:
Neural net analysis of integrated circuit yield dependence on CMOS process control parameters.
117-121
Electronic Edition (link) BibTeX
- Kuo-Ming Chen, Kuo-Ning Chiang:
Impact of probing procedure on flip chip reliability.
123-130
Electronic Edition (link) BibTeX
- Chi-Hui Chien, Yung-Chang Chen, Yii-Tay Chiou, Thaiping Chen, Chi-Chang Hsieh, Jia-Jin Yan, Wei-Zhi Chen, Yii-Der Wu:
Influences of the moisture absorption on PBGA package's warpage during IR reflow process.
131-139
Electronic Edition (link) BibTeX
- Harry K. Charles Jr., K. J. Mach, S. J. Lehtonen, Arthur S. Francomacaro, J. S. DeBoy, R. L. Edwards:
Wirebonding at higher ultrasonic frequencies: reliability and process implications.
141-153
Electronic Edition (link) BibTeX
- Thomas D. Moore, John L. Jarvis:
Thermomechanical deformation of a bimaterial plate--as applied to laminate IC assemblies.
155-162
Electronic Edition (link) BibTeX
- David C. T. Or, P. T. Lai, J. K. O. Sin, Paul C. K. Kwok, J. P. Xu:
Enhanced reliability for low-temperature gate dielectric of MOS devices by N2O or NO plasma nitridation.
163-166
Electronic Edition (link) BibTeX
- Roland Sorge:
Implant dose monitoring by MOS C-V measurement.
167-171
Electronic Edition (link) BibTeX
- T. Beauchêne, D. Lewis, Felix Beaudoin, V. Pouget, Philippe Perdu, P. Fouillat, Y. Danto:
A physical approach on SCOBIC investigation in VLSI.
173-177
Electronic Edition (link) BibTeX
Volume 43,
Number 2,
February 2003
- H. E. Aldrete-Vidrio, J. L. del Valle, J. Santana-Corte:
A TCAD comparative study of power rectifiers: modified P-i-N vs. modified mosaic contact P-i-N diode.
181-188
Electronic Edition (link) BibTeX
- Magali Estrada, A. Afzalian, Denis Flandre, Antonio Cerdeira, H. Baez, A. de Lucca:
FD MOS SOI circuit to enhance the ratio of illuminated to dark current of a co-integrated a-Si: H photodiode.
189-193
Electronic Edition (link) BibTeX
- R. Murphy-Arteaga, J. Huerta-Chua, Alejandro Díaz-Sánchez, A. Torres-Jécome, W. Calleja-Arriaga, M. Landa-Vázquez:
Fabrication, characterisation and modelling of integrated on-silicon inductors.
195-201
Electronic Edition (link) BibTeX
- Javier Lemus-López, Alejandro Díaz-Sánchez, Jaime Ramírez-Angulo:
An analog median filter with fuzzy adaptation.
203-207
Electronic Edition (link) BibTeX
- D. Lopes de Oliveira, M. Strum, W. J. Chau, W. C. Cunha:
Miriã: a CAD tool to synthesize multi-burst controllers for heterogeneous systems.
209-215
Electronic Edition (link) BibTeX
- D. Torres, A. Redondo, M. E. Guzmán:
MSOH processor for STM-0/STS-1 to STM-4/STS-12: component of a SDH/SONET library.
217-223
Electronic Edition (link) BibTeX
- Sima Dimitrijev, Philippe Jamet:
Advances in SiC power MOSFET technology.
225-233
Electronic Edition (link) BibTeX
- M. Pecovska-Gjorgjevich, N. Novkovski, E. Atanassova:
Electrical properties of thin RF sputtered Ta2O5 films after constant current stress.
235-241
Electronic Edition (link) BibTeX
- François Dieudonné, Sébastien Haendler, Jalal Jomaah, Francis Balestra:
Low frequency noise in 0.12 mum partially and fully depleted SOI technology.
243-248
Electronic Edition (link) BibTeX
- Paul Isaac Hagouel:
Blazed diffraction gratings fabricated using X-ray lithography: fabrication, modeling and simulation.
249-258
Electronic Edition (link) BibTeX
- K. S. Kim, S. H. Huh, K. Suganuma:
Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu.
259-267
Electronic Edition (link) BibTeX
- J. D. Wu, C. Y. Huang, C. C. Liao:
Fracture strength characterization and failure analysis of silicon dies.
269-277
Electronic Edition (link) BibTeX
- C. W. Tan, Y. C. Chan, N. H. Yeung:
Effect of autoclave test on anisotropic conductive joints.
279-285
Electronic Edition (link) BibTeX
- Ajit R. Dhamdhere, Ajay P. Malshe, William F. Schmidt, William D. Brown:
Investigation of reliability issues in high power laser diode bar packages.
287-295
Electronic Edition (link) BibTeX
- Paiboon Tangyunyong:
Thermal modeling of localized laser heating in multi-level interconnects.
297-305
Electronic Edition (link) BibTeX
- Bart Vandevelde, Dominiek Degryse, Eric Beyne, Eric Roose, Dorina Corlatan, Guido Swaelen, Geert Willems, Filip Christiaens, Alcatel Bell, Dirk Vandepitte:
Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packages.
307-318
Electronic Edition (link) BibTeX
- Sasa A. Jankovic, Dejan M. Maksimovic:
Power saving modes in modern microcontroller design, diagnostics and reliability.
319-326
Electronic Edition (link) BibTeX
- M. M. Shahidul Hassan:
Base transit time of an epitaxial n+pn-n+ bipolar transistor considering Kirk effect.
327-332
Electronic Edition (link) BibTeX
- Sadegh Abbasian, Ebrahim Farjah:
A new drain current model for short-channel MOSFETs.
333-338
Electronic Edition (link) BibTeX
- Keiji Takagi:
A study on 1/f noise spectrum generation in nonlinear transmission media and biomedical systems.
339-342
Electronic Edition (link) BibTeX
Volume 43,
Number 3,
March 2003
- Andrzej Dziedzic:
Special Section on IMAPS-Europe 2002.
343
Electronic Edition (link) BibTeX
- Jürgen Wilde, Yuqing Lai:
Design optimization of an eddy current sensor using the finite-elements method.
345-349
Electronic Edition (link) BibTeX
- Arun Chandrasekhar, Steven Brebels, Serguei Stoukatch, Eric Beyne, Walter De Raedt, Bart Nauwelaers:
The influence of packaging materials on RF performance.
351-357
Electronic Edition (link) BibTeX
- Jürgen Schulz-Harder:
Advantages and new development of direct bonded copper substrates.
359-365
Electronic Edition (link) BibTeX
- Guo Lihui, Yu Mingbin, Foo Pang Dow:
RF inductors and capacitors integrated on silicon chip by CMOS compatible Cu interconnect technology.
367-370
Electronic Edition (link) BibTeX
- J. Müller, J. Klein, J. Rayho:
In-process verification of MLC substrates.
371-375
Electronic Edition (link) BibTeX
- Andrzej Dziedzic, Lars Rebenklau, Leszek J. Golonka, Klaus-Jürgen Wolter:
Fodel microresistors-processing and basic electrical properties.
377-383
Electronic Edition (link) BibTeX
- Kinam Kim, Yoon J. Song:
Integration technology for ferroelectric memory devices.
385-398
Electronic Edition (link) BibTeX
- Mansun Chan, Xuemei Xi, Jin He, Kanyu M. Cao, Mohan V. Dunga, Ali M. Niknejad, Ping K. Ko, Chenming Hu:
Practical compact modeling approaches and options for sub-0.1 mum CMOS technologies.
399-404
Electronic Edition (link) BibTeX
- Handoko Linewih, Sima Dimitrijev, Kuan Yew Cheong:
Channel-carrier mobility parameters for 4H SiC MOSFETs.
405-411
Electronic Edition (link) BibTeX
- S. Hidalgo, D. Flores, I. Obieta, I. Mazarredo:
Passivation and packaging of positive bevelled edge termination and related electrical stability.
413-420
Electronic Edition (link) BibTeX
- Yang-Hua Chang, Chen-Chun Chang-Chiang, Yueh-Cheng Lee, Chi-Chung Liu:
Design of multi-finger HBTs with a thermal-electrical model.
421-426
Electronic Edition (link) BibTeX
- V. A. Vashchenko, A. Concannon, M. ter Beek, P. Hopper:
Quasi-3D simulation approach for comparative evaluation of triggering ESD protection structures.
427-437
Electronic Edition (link) BibTeX
- T. Beauchêne, D. Lewis, Felix Beaudoin, V. Pouget, Romain Desplats, P. Fouillat, Philippe Perdu, M. Bafleur, D. Trémouilles:
Thermal laser stimulation and NB-OBIC techniques applied to ESD defect localization.
439-444
Electronic Edition (link) BibTeX
- Petteri Palm, Jarmo Määttänen, Yannick De Maquillé, Alain Picault, Jan Vanfleteren, Björn Vandecasteele:
Comparison of different flex materials in high density flip chip on flex applications.
445-451
Electronic Edition (link) BibTeX
- R. K. Shiue, L. W. Tsay, C. L. Lin, J. L. Ou:
The reliability study of selected Sn-Zn based lead-free solders on Au/Ni-P/Cu substrate.
453-463
Electronic Edition (link) BibTeX
- Yuko Sawada, Kozo Harada, Hirofumi Fujioka:
Study of package warp behavior for high-performance flip-chip BGA.
465-471
Electronic Edition (link) BibTeX
- Hirokazu Ezawa, Masaharu Seto, Masahiro Miyata, Hiroshi Tazawa:
Polymer film deposition with fine pitch openings by stencil printing.
473-479
Electronic Edition (link) BibTeX
- C. W. Tan, Y. C. Chan, N. H. Yeung:
Behaviour of anisotropic conductive joints under mechanical loading.
481-486
Electronic Edition (link) BibTeX
- Thomas D. Moore, John L. Jarvis:
A simple and fundamental design rule for resisting delamination in bimaterial structures.
487-494
Electronic Edition (link) BibTeX
- W. L. Pearn, Ming-Hung Shu:
An algorithm for calculating the lower confidence bounds of CPU and CPL with application to low-drop-out linear regulators.
495-502
Electronic Edition (link) BibTeX
- Takeshi Yanagisawa, Takeshi Kojima:
The stability of the CuInSe2 solar mini-module I-V characteristics under continuous and light/dark irradiation cycle tests.
503-507
Electronic Edition (link) BibTeX
- G. Golan, A. Axelevitch, B. Sigalov, B. Gorenstein:
Integrated thin film heater-thermocouple systems.
509-512
Electronic Edition (link) BibTeX
- Mile K. Stojcev:
Memory Design Techniques for Low Energy Embedded Systems; Alberto Macii, Luca Benini, Massimo Poncino. Kluwer Academic Publishers, Boston, USA, 2002. Hard cover, pp 144 plus XI, ISBN 0-7923-7690-0.
513
Electronic Edition (link) BibTeX
- Mile K. Stojcev:
A designer's guide to built-in self-test; Charles E. Stround. Kluwer Academic Publishers, Boston, 2002. Hardcover, pp 319, plus XVI, ISBN 1-4020-7050-0.
514-515
Electronic Edition (link) BibTeX
- Mile K. Stojcev:
Semiconductor Memories: Technologies, Testing and Reliability; Ashok K. Sharma. IEEE Press and Wiley Interscience, New York, 1997. Hardcover, pp 462, plus XII, ISBN 0-7803-1000-4.
515
Electronic Edition (link) BibTeX
Volume 43,
Number 4,
April 2003
- Vitezslav Benda:
The quest for optimum technology of power semiconductor devices.
517
Electronic Edition (link) BibTeX
- N. Y. A. Shammas:
Present problems of power module packaging technology.
519-527
Electronic Edition (link) BibTeX
- Josef Lutz, Martin Domeij:
Dynamic avalanche and reliability of high voltage diodes.
529-536
Electronic Edition (link) BibTeX
- J. Vobecký, P. Hazdra, V. Záhlava:
Impact of the electron, proton and helium irradiation on the forward I-V characteristics of high-power P-i-N diode.
537-544
Electronic Edition (link) BibTeX
- M. Blaho, Dionyz Pogany, E. Gornik, M. Denison, G. Groos, M. Stecher:
Study of internal behavior in a vertical DMOS transistor under short high current stress by an interferometric mapping method.
545-548
Electronic Edition (link) BibTeX
- F. Velardi, F. Iannuzzo, G. Busatto, J. Wyss, A. Candelori:
Experimental study of charge generation mechanisms in power MOSFETs due to energetic particle impact, .
549-555
Electronic Edition (link) BibTeX
- V. Papez, B. Kojecký, J. Kozísek, J. Hejhal:
Transient effects on high voltage diode stack under reverse bias.
557-564
Electronic Edition (link) BibTeX
- B. Morillon, Jean-Marie Dilhac, Christian Ganibal, C. Anceau:
Study of aluminum thermomigration as a low thermal budget technique for innovative power devices.
565-569
Electronic Edition (link) BibTeX
- Adeline Feybesse, Ivana Deram, Jean-Michel Reynes, Eric Moreau:
Copper metallization influence on power MOS reliability.
571-576
Electronic Edition (link) BibTeX
- Giovanni Busatto, Roberto La Capruccia, Francesco Iannuzzo, Francesco Velardi, Roberto Roncella:
MAGFET based current sensing for power integrated circuit.
577-583
Electronic Edition (link) BibTeX
- Hei Wong:
Low-frequency noise study in electron devices: review and update.
585-599
Electronic Edition (link) BibTeX
- Minkyu Je, Jeonghu Han, Hyungcheol Shin, Kwyro Lee:
A simple four-terminal small-signal model of RF MOSFETs and its parameter extraction.
601-609
Electronic Edition (link) BibTeX
- Jackie Chan, Hei Wong, M. C. Poon, C. W. Kok:
Oxynitride gate dielectric prepared by thermal oxidation of low-pressure chemical vapor deposition silicon-rich silicon nitride.
611-616
Electronic Edition (link) BibTeX
- S. K. Manhas, D. Chandra Sekhar, A. S. Oates, M. M. De Souza:
Characterisation of series resistance degradation through charge pumping technique.
617-624
Electronic Edition (link) BibTeX
- C. Y. Yin, M. O. Alam, Y. C. Chan, C. Bailey, Hua Lu:
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications.
625-633
Electronic Edition (link) BibTeX
- C. Hillman, B. Castillo, Michael G. Pecht:
Diffusion and absorption of corrosive gases in electronic encapsulants.
635-643
Electronic Edition (link) BibTeX
- P. Heino, Eero Ristolainen:
Strength of Ta-Si interfaces by molecular dynamics.
645-650
Electronic Edition (link) BibTeX
- W. L. Pearn, G. H. Lin:
A reliable procedure for testing linear regulators with one-sided specification limits based on multiple samples.
651-664
Electronic Edition (link) BibTeX
- V. A. Gritsenko, A. V. Shaposhnikov, Yu. N. Novikov, A. P. Baraban, Hei Wong, G. M. Zhidomirov, M. Roger:
Onefold coordinated oxygen atom: an electron trap in the silicon oxide.
665-669
Electronic Edition (link) BibTeX
- N. A. Hastas, C. A. Dimitriadis, F. V. Farmakis, G. Kamarinos:
Effects of hydrogenation on the performance and stability of p-channel polycrystalline silicon thin-film transistors.
671-674
Electronic Edition (link) BibTeX
- Z. Synowiec, B. Paszkiewicz:
Electron transport in implant isolation GaAs layers.
675-679
Electronic Edition (link) BibTeX
- Johan Liu:
Foldable Flex and Thinned Silicon Chips for Multichip Packaging; John Balde (Ed.), Kluwer Academic Publishers, Boston, USA, December 2002. Hardbound, 340 pp, Number of figures and tables 200, ISBN 0-7923-7676-5.
681-683
Electronic Edition (link) BibTeX
- Mile K. Stojcev:
System Design with System C; Thorsten Grotker, Stan Liao, Grant Martin, Stuart Swan. Kluwer Academic Publishers, Boston, 2002. Hardcover, pp 217, plus X, ISBN 1-4020-7027-1.
683-684
Electronic Edition (link) BibTeX
Volume 43,
Number 5,
May 2003
- Mark Zwolinski, M. S. Gaur:
Integrating testability with design space exploration.
685-693
Electronic Edition (link) BibTeX
- Reza Ghaffarian:
Qualification approaches and thermal cycle test results for CSP/BGA/FCBGA.
695-706
Electronic Edition (link) BibTeX
- Ru Huang, Jinyan Wang, Jin He, Min Yu, Xing Zhang, Yangyuan Wang:
Hot carrier degradation behavior in SOI dynamic-threshold-voltage nMOSFET's (n-DTMOSFET) measured by gated-diode configuration.
707-711
Electronic Edition (link) BibTeX
- Summer F. C. Tseng, Wei-Ting Kary Chien, Bing-Chu Cai:
Improvement of poly-silicon hole induced gate oxide failure by silicon rich oxidation.
713-724
Electronic Edition (link) BibTeX
- Xiaofang Gao, Juin J. Liou, Joe Bernier, Gregg Croft, Waisum Wong, Satya Vishwanathan:
Optimization of on-chip ESD protection structures for minimal parasitic capacitance.
725-733
Electronic Edition (link) BibTeX
- Chihoon Lee, Donggun Park, Hyeong Joon Kim, Wonshik Lee:
Electrical reliability of highly reliable 256M-bit mobile DRAM with top-edge round STI and dual gate oxide.
735-739
Electronic Edition (link) BibTeX
- Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton, Zhaowei Zhong:
Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill.
741-749
Electronic Edition (link) BibTeX
- Qian Wang, Naoe Hosoda, Toshihiro Itoh, Tadatomo Suga:
Reliability of Au bump-Cu direct interconnections fabricated by means of surface activated bonding method.
751-756
Electronic Edition (link) BibTeX
- K. S. Kim, C. H. Yu, N. H. Kim, N. K. Kim, H. J. Chang, E. G. Chang:
Isothermal aging characteristics of Sn-Pb micro solder bumps.
757-763
Electronic Edition (link) BibTeX
- W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst, F. Su, Kerm Sin Chian, Sung Yi:
Prediction and verification of process induced warpage of electronic packages.
765-774
Electronic Edition (link) BibTeX
- Ping Zhao, Michael G. Pecht:
Field failure due to creep corrosion on components with palladium pre-plated leadframes.
775-783
Electronic Edition (link) BibTeX
- Z. Zhao:
Thermal design of a broadband communication system with detailed modeling of TBGA packages.
785-793
Electronic Edition (link) BibTeX
- Vencislav Valchev, Alex Van den Bossche:
Accurate natural convection modelling for magnetic components.
795-802
Electronic Edition (link) BibTeX
- T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu:
Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages.
803-809
Electronic Edition (link) BibTeX
- T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua:
Development of the green plastic encapsulation for high density wirebonded leaded packages.
811-817
Electronic Edition (link) BibTeX
- Mile K. Stojcev:
High Performance Memory Testing: Design Principles, Fault Modeling and Self-Test; R. Dean Adams, Kluwer Academic Publishers, Boston, 2003, Hardcover, pp 247, plus XIII, ISBN 1-4020-7255-4.
819
Electronic Edition (link) BibTeX
Volume 43,
Number 6,
June 2003
- Wallace T. Anderson, Roberto Menozzi:
Editorial.
821
Electronic Edition (link) BibTeX
- Hyungtak Kim, Alexei Vertiatchikh, Richard M. Thompson, Vinayak Tilak, Thomas R. Prunty, James R. Shealy, Lester F. Eastman:
Hot electron induced degradation of undoped AlGaN/GaN HFETs.
823-827
Electronic Edition (link) BibTeX
- Frank Gao:
High reliability in PHEMT MMICs with dual-etch-stop AlAs layers for high-speed RF switch applications.
829-837
Electronic Edition (link) BibTeX
- F. Brunner, A. Braun, P. Kurpas, J. Schneider, J. Würfl, M. Weyers:
Investigation of short-term current gain stability of GaInP/GaAs-HBTs grown by MOVPE.
839-844
Electronic Edition (link) BibTeX
- William J. Rowe, Bruce M. Paine, Adele E. Schmitz, Robert H. Walden, Michael J. Delaney:
Reliability of 100 nm silicon nitride capacitors in an InP HEMT MMIC process.
845-851
Electronic Edition (link) BibTeX
- Bruce M. Paine, Ami P. Shah, Thomas Rust:
The effects of ternary alloys on thermal resistances of HBTs, HEMTs, and laser diodes.
853-858
Electronic Edition (link) BibTeX
- Charles S. Whitman:
Accelerated life test calculations using the method of maximum likelihood: an improvement over least squares.
859-864
Electronic Edition (link) BibTeX
- R.-P. Vollertsen:
Thin dielectric reliability assessment for DRAM technology with deep trench storage node.
865-878
Electronic Edition (link) BibTeX
- John J. H. Reche, Deok-Hoon Kim:
Wafer level packaging having bump-on-polymer structure.
879-894
Electronic Edition (link) BibTeX
- J. C. Tinoco, Magali Estrada, G. Romero:
Room temperature plasma oxidation mechanism to obtain ultrathin silicon oxide and titanium oxide layers.
895-903
Electronic Edition (link) BibTeX
- I. Stanimirovic, Milan Jevtic, Z. Stanimirovic:
High-voltage pulse stressing of thick-film resistors and noise.
905-911
Electronic Edition (link) BibTeX
- Hong Meng Ho, Wai Lam, Serguei Stoukatch, Petar Ratchev, Charles J. Vath, Eric Beyne:
Direct gold and copper wires bonding on copper.
913-923
Electronic Edition (link) BibTeX
- Po-Jen Zheng, J. Z. Lee, K. H. Liu, J. D. Wu, S. C. Hung:
Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls.
925-934
Electronic Edition (link) BibTeX
- D. S. Liu, Y. C. Chao, C. H. Lin, G. S. Shen, H. S. Liu:
Numerical study on the bonding tool position, tip profile and planarity angle influences on TAB/ILB interconnection reliability.
935-943
Electronic Edition (link) BibTeX
- Dominik Kasprowicz, Witold A. Pleskacz:
Improvement of integrated circuit testing reliability by using the defect based approach.
945-953
Electronic Edition (link) BibTeX
- Belén Calvo, Santiago Celma, Pedro A. Martínez, Maria Teresa Sanz:
Novel high performance CMOS current conveyor.
955-961
Electronic Edition (link) BibTeX
- W. L. Pearn, Ming-Hung Shu:
Manufacturing capability control for multiple power-distribution switch processes based on modified Cpk MPPAC.
963-975
Electronic Edition (link) BibTeX
- Takeshi Yanagisawa, Takeshi Kojima:
Degradation of InGaN blue light-emitting diodes under continuous and low-speed pulse operations.
977-980
Electronic Edition (link) BibTeX
- B. Alpat, R. Battiston, M. Bizzarri, D. Caraffini, E. Fiori, A. Papi, M. Petasecca, A. Pontetti:
The radiation sensitivity mapping of ICs using an IR pulsed laser system.
981-984
Electronic Edition (link) BibTeX
Volume 43,
Number 7,
July 2003
- Horst A. Gieser:
On-chip electrostatic discharge ESD.
985-986
Electronic Edition (link) BibTeX
- Steven S. Poon, Timothy J. Maloney:
New considerations for MOSFET power clamps.
987-991
Electronic Edition (link) BibTeX
- Markus P. J. Mergens, Christian C. Russ, Koen G. Verhaege, John Armer, Phillip Jozwiak, Russ Mohn:
High holding current SCRs (HHI-SCR) for ESD protection and latch-up immune IC operation.
993-1000
Electronic Edition (link) BibTeX
- M. Streibl, K. Esmark, A. Sieck, Wolfgang Stadler, M. Wendel, J. Szatkowski, Harald Gossner:
Harnessing the base-pushout effect for ESD protection in bipolar and BiCMOS technologies.
1001-1010
Electronic Edition (link) BibTeX
- Vesselin K. Vassilev, S. Jenei, Guido Groeseneken, R. Venegas, S. Thijs, V. De Heyn, M. Natarajan Iyer, Michiel Steyaert, H. E. Maes:
High frequency characterization and modelling of the parasitic RC performance of two terminal ESD CMOS protection devices.
1011-1020
Electronic Edition (link) BibTeX
- Sopan Joshi, Elyse Rosenbaum:
Simulator-independent compact modeling of vertical npn transistors for ESD and RF circuit simulation.
1021-1027
Electronic Edition (link) BibTeX
- Boris Lisenker:
Process influence on product CDM ESD performance.
1029-1037
Electronic Edition (link) BibTeX
- Sherry Suat Cheng Khoo, Pee Ya Tan, Steven H. Voldman:
Microanalysis and electromigration reliability performance of high current transmission line pulse (TLP) stressed copper interconnects.
1039-1045
Electronic Edition (link) BibTeX
- Ingrid De Wolf:
MEMS reliability.
1047-1048
Electronic Edition (link) BibTeX
- W. Merlijn van Spengen:
MEMS reliability from a failure mechanisms perspective.
1049-1060
Electronic Edition (link) BibTeX
- X. Lafontan, F. Pressecq, Felix Beaudoin, S. Rigo, M. Dardalhon, J.-L. Roux, P. Schmitt, J. Kuchenbecker, B. Baradat, D. Lellouchi:
The advent of MEMS in space.
1061-1083
Electronic Edition (link) BibTeX
- Roland Müller-Fiedler, Volker Knoblauch:
Reliability aspects of microsensors and micromechatronic actuators for automotive applications.
1085-1097
Electronic Edition (link) BibTeX
- A. Dommann, A. Enzler, N. Onda:
Advanced X-ray analysis techniques to investigate aging of micromachined silicon actuators for space application.
1099-1103
Electronic Edition (link) BibTeX
- X. Q. Shi, Z. P. Wang, J. P. Pickering:
A new methodology for the characterization of fracture toughness of filled epoxy films involved in microelectronics packages.
1105-1115
Electronic Edition (link) BibTeX
- Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong:
Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications.
1117-1123
Electronic Edition (link) BibTeX
- Y. Deshayes, L. Béchou, J.-Y. Delétage, F. Verdier, Y. Danto, D. Laffitte, J. L. Goudard:
Three-dimensional FEM simulations of thermomechanical stresses in 1.55 mum Laser modules.
1125-1136
Electronic Edition (link) BibTeX
- J.-Y. Delétage, F. J.-M. Verdier, B. Plano, Y. Deshayes, L. Béchou, Y. Danto:
Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations.
1137-1144
Electronic Edition (link) BibTeX
- M. Jagadesh Kumar, C. Linga Reddy:
2D-simulation and analysis of lateral SiC N-emitter SiGe P-base Schottky metal-collector (NPM) HBT on SOI.
1145-1149
Electronic Edition (link) BibTeX
- Xiang-Ti Meng, Ai-Guo Kang, Ji-Hong Li, Hai-Yun Zhang, Shi-jie Yu, Zheng You:
Effects of electron and gamma-ray irradiation on CMOS analog image sensors.
1151-1155
Electronic Edition (link) BibTeX
- Timo Liukkonen, Aulis Tuominen:
Decreasing variation in paste printing using statistical process control.
1157-1161
Electronic Edition (link) BibTeX
- Haifeng Zhou, Zhenghui Lin, Wei Cao:
ILP method for memory mapping in high-level synthesis.
1163-1167
Electronic Edition (link) BibTeX
- Thomas D. Moore, John L. Jarvis:
Erratum to "A simple and fundamental design rule for resisting delamination in bimaterial structures" [Microelectronics Reliability 2003;43: 487-494].
1169
Electronic Edition (link) BibTeX
- Mile K. Stojcev:
Rohit Kapur, CTL for Test Information of Digital ICs Hardcover. Kluwer Academic Publisher, Boston, 2003. pp 173, plus XI, ISBN 1-4020-7293-7.
1171-1172
Electronic Edition (link) BibTeX
Volume 43,
Number 8,
August 2003
- G. Ghibaudo, E. Vincent:
Guest Editorial.
1173
Electronic Edition (link) BibTeX
- Ernest Y. Wu, Jordi Suñé, Wing L. Lai, Alex Vayshenker, Edward J. Nowak, David L. Harmon:
Critical reliability challenges in scaling SiO2-based dielectric to its limit.
1175-1184
Electronic Edition (link) BibTeX
- Jordi Suñé, Ernest Y. Wu, D. Jiménez, Wing L. Lai:
Statistics of soft and hard breakdown in thin SiO2 gate oxides.
1185-1192
Electronic Edition (link) BibTeX
- James H. Stathis, R. Rodríguez, Barry P. Linder:
Circuit implications of gate oxide breakdown.
1193-1197
Electronic Edition (link) BibTeX
- F. Monsieur, E. Vincent, V. Huard, S. Bruyère, D. Roy, Thomas Skotnicki, G. Pananakakis, G. Ghibaudo:
On the role of holes in oxide breakdown mechanism in inverted nMOSFETs.
1199-1202
Electronic Edition (link) BibTeX
- M. Porti, S. Meli, M. Nafría, X. Aymerich:
Pre-breakdown noise in electrically stressed thin SiO2 layers of MOS devices observed with C-AFM.
1203-1209
Electronic Edition (link) BibTeX
- G. Ribes, S. Bruyère, F. Monsieur, D. Roy, V. Huard:
New insights into the change of voltage acceleration and temperature activation of oxide breakdown.
1211-1214
Electronic Edition (link) BibTeX
- Andreas Martin, Jochen von Hagen, Glenn B. Alers:
Ramped current stress for fast and reliable wafer level reliability monitoring of thin gate oxide reliability.
1215-1220
Electronic Edition (link) BibTeX
- G. Ghidini, A. Garavaglia, G. Giusto, A. Ghetti, R. Bottini, D. Peschiaroli, M. Scaravaggi, F. Cazzaniga, D. Ielmini:
Impact of gate stack process on conduction and reliability of 0.18 mum PMOSFET.
1221-1227
Electronic Edition (link) BibTeX
- A. Ghetti, D. Brazzelli, A. Benvenuti, G. Ghidini, A. Pavan:
Anomalous gate oxide conduction on isolation edges: analysis and process optimization.
1229-1235
Electronic Edition (link) BibTeX
- C. Besset, S. Bruyère, S. Blonkowski, S. Crémer, E. Vincent:
MIM capacitance variation under electrical stress.
1237-1240
Electronic Edition (link) BibTeX
- A. Bravaix, C. Trapes, D. Goguenheim, N. Revil, E. Vincent:
Carrier injection efficiency for the reliability study of 3.5-1.2 nm thick gate-oxide CMOS technologies.
1241-1246
Electronic Edition (link) BibTeX
- S. Cimino, A. Cester, Alessandro Paccagnella, G. Ghidini:
Ionising radiation effects on MOSFET drain current.
1247-1251
Electronic Edition (link) BibTeX
- Albena Paskaleva, Martin Lemberger, Stefan Zürcher, Anton J. Bauer, Lothar Frey, Heiner Ryssel:
Electrical characterization of zirconium silicate films obtained from novel MOCVD precursors.
1253-1257
Electronic Edition (link) BibTeX
- F. Mondon, S. Blonkowski:
Electrical characterisation and reliability of HfO2 and Al2O3-HfO2 MIM capacitors.
1259-1266
Electronic Edition (link) BibTeX
- Kenji Takahashi, Mitsuo Umemoto, Naotaka Tanaka, Kazumasa Tanida, Yoshihiko Nemoto, Yoshihiro Tomita, Masamoto Tago, Manabu Bonkohara:
Ultra-high-density interconnection technology of three-dimensional packaging.
1267-1279
Electronic Edition (link) BibTeX
- R. García, Magali Estrada, Antonio Cerdeira:
Effects of impurity concentration, hydrogen plasma process and crystallization temperature on poly-crystalline films obtained from PECVD a-Si: H layers.
1281-1287
Electronic Edition (link) BibTeX
- K. L. Ng, Nian Zhan, C. W. Kok, M. C. Poon, Hei Wong:
Electrical characterization of the hafnium oxide prepared by direct sputtering of Hf in oxygen with rapid thermal annealing.
1289-1293
Electronic Edition (link) BibTeX
- I-Cheng Lin, Chih-Yao Huang, Chuan-Jane Chao, Ming-Dou Ker:
Anomalous latchup failure induced by on-chip ESD protection circuit in a high-voltage CMOS IC product.
1295-1301
Electronic Edition (link) BibTeX
- J. H. Zhang, Y. C. Chan, M. O. Alam, S. Fu:
Contact resistance and adhesion performance of ACF interconnections to aluminum metallization.
1303-1310
Electronic Edition (link) BibTeX
- Y. S. Zheng, Y. J. Su, B. Yu, P. D. Foo:
Investigation of defect on copper bond pad surface in copper/low k process integration.
1311-1316
Electronic Edition (link) BibTeX
- N. Duan, J. Scheer, J. Bielen, M. van Kleef:
The influence of Sn-Cu-Ni(Au) and Sn-Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates.
1317-1327
Electronic Edition (link) BibTeX
- Tong Yan Tee, Hun Shen Ng, Daniel Yap, Zhaowei Zhong:
Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages.
1329-1338
Electronic Edition (link) BibTeX
- Li-Rong Zheng, Johan Liu:
System-on-package: a broad perspective from system design to technology development.
1339-1348
Electronic Edition (link) BibTeX
- W. L. Pearn, Ming-Hung Shu:
Erratum to "An algorithm for calculating the lower confidence bounds of CPU and CPL with application to low-drop-out linear regulators" [Microelectronics Reliability 2003;43: 495-502].
1349
Electronic Edition (link) BibTeX
Volume 43,
Numbers 9-11,
September - November 2003
14th European Symposium on Reliability of Electron Devices,
Failure Physics and Analysis
- Nathalie Labat, André Touboul:
Editorial.
1351-1352
Electronic Edition (link) BibTeX
- James H. Stathis, Barry P. Linder, R. Rodríguez, Salvatore Lombardo:
Reliability of ultra-thin oxides in CMOS circuits.
1353-1360
Electronic Edition (link) BibTeX
- D. Dufourt, J. L. Pelloie:
SOI design challenges.
1361-1367
Electronic Edition (link) BibTeX
- Lawrence C. Wagner:
Trends in Failure Analysis.
1369-1375
Electronic Edition (link) BibTeX
- A. Andreini, C. Neva, L. Renard, G. Sironi, F. Speroni, L. Sponton, F. Tampellini, R. Tiziani:
Pad Over Active (POA) solutions for three metal level BCD5 mixed power process - Design and validation of ESD protections.
1377-1382
Electronic Edition (link) BibTeX
- Th. Nirschl, M. Ostermayr, A. Olbrich, D. Vietzke, M. Omer, C. Linnenbank, U. Schaper, Y. Pottgiesser, J. Pottgiesser, M. Johansson:
MALTY--A memory test structure for analysis in the early phase of the technology development.
1383-1387
Electronic Edition (link) BibTeX
- G. Aichmayr:
Correlation of gate oxide reliability and product tests on leading edge DRAM technology.
1389-1393
Electronic Edition (link) BibTeX
- A. Aal:
A procedure for reliability control and optimization of mixed-signal smart power CMOS pocesses.
1395-1400
Electronic Edition (link) BibTeX
- P. Charpenel, F. Davenel, R. Digout, M. Giraudeau, M. Glade, J. P. Guerveno, N. Guillet, A. Lauriac, S. Male, D. Manteigas:
The right way to assess electronic system reliability: FIDES.
1401-1404
Electronic Edition (link) BibTeX
- Yong-Ha Song, S. G. Kim, S. B. Lee, K. J. Rhee, T. S. Kim:
A study of considering the reliability issues on ASIC/Memory integration by SIP (System-in-Package) technology.
1405-1410
Electronic Edition (link) BibTeX
- G. Cassanelli, Fausto Fantini, G. Serra, S. Sgatti:
Reliability in automotive electronics: a case study applied to diesel engine control.
1411-1416
Electronic Edition (link) BibTeX
- Gerald Lucovsky:
Electronic structure of transition metal/rare earth alternative high-K gate dielectrics: interfacial band alignments and intrinsic defects.
1417-1426
Electronic Edition (link) BibTeX
- Jong-Tae Park, Nag Jong Choi, Chong-Gun Yu, Seok Hee Jeon, Jean-Pierre Colinge:
Increased hot carrier effects in Gate-All-Around SOI nMOSFET's.
1427-1432
Electronic Edition (link) BibTeX
- M. Fadlallah, C. Petit, A. Meinertzhagen, G. Ghibaudo, M. Bidaud, O. Simonetti, F. Guyader:
Influence of nitradation in ultra-thin oxide on the gate current degradation of N and PMOS devices.
1433-1438
Electronic Edition (link) BibTeX
- R. Rodríguez, James H. Stathis, Barry P. Linder, Rajiv V. Joshi, Ching-Te Chuang:
Influence and model of gate oxide breakdown on CMOS inverters.
1439-1444
Electronic Edition (link) BibTeX
- F. Lime, G. Ghibaudo, B. Guillaumot:
Charge trapping in SiO2/HfO2/TiN gate stack.
1445-1448
Electronic Edition (link) BibTeX
- Yuan Li, Klaas Jelle Veenstra, Jerôme Dubois, Lei Peters-Wu, Agnes van Zomeren, Fred G. Kuper:
Reservoir effect and maximum allowed VIA misalignment for AlCu interconnect with tungsten VIA plug.
1449-1454
Electronic Edition (link) BibTeX
- S. Djoric-Veljkovic, I. Manic, V. Davidovic, S. Golubovic, Ninoslav Stojadinovic:
Effects of burn-in stressing on post-irradiation annealing response of power VDMOSFETs.
1455-1460
Electronic Edition (link) BibTeX
- Young Pil Kim, U-In Chung, Joo Tae Moon, Sang U. Kim:
Electrical analysis of DRAM cell transistors for the root-cause addressing of the tRDL time-delay failure.
1461-1464
Electronic Edition (link) BibTeX
- Werner Frammelsberger, Guenther Benstetter, Thomas Schweinboeck, Richard J. Stamp, Janice Kiely:
Characterization of thin and ultra-thin SiO2 films and SiO2/Si interfaces with combined conducting and topographic atomic force microscopy.
1465-1470
Electronic Edition (link) BibTeX
- K. L. Pey, C. H. Tung, M. K. Radhakrishnan, L. J. Tang, Y. Sun, X. D. Wang, W. H. Lin:
Correlation of failure mechanism of constant-current-stress and constant-voltage-stress breakdowns in ultrathin gate oxides of nMOSFETs by TEM.
1471-1476
Electronic Edition (link) BibTeX
- Se Re Na Yun, Won Sub Park, Byung Ha Lee, Jong-Tae Park:
Hot electron induced punchthrough voltage of p-channel SOI MOSFET's at room and elevated temperatures.
1477-1482
Electronic Edition (link) BibTeX
- S. Aresu, Ward De Ceuninck, G. Knuyt, J. Mertens, J. Manca, Luc De Schepper, Robin Degraeve, Ben Kaczer, Marc D'Olieslaeger, Jan D'Haen:
A new method for the analysis of high-resolution SILC data.
1483-1488
Electronic Edition (link) BibTeX
- D. Zander, F. Saigné, A. Meinertzhagen, C. Petit:
Contribution of oxide traps on defect creation and LVSILC conduction in ultra thin gate oxide devices.
1489-1493
Electronic Edition (link) BibTeX
- Andreas Gehring, F. Jiménez-Molinos, Hans Kosina, A. Palma, F. Gámiz, Siegfried Selberherr:
Modeling of retention time degradation due to inelastic trap-assisted tunneling in EEPROM devices.
1495-1500
Electronic Edition (link) BibTeX
- M. Porti, M. Nafría, X. Aymerich:
Oxide conductivity increase during the progressive-breakdown of SiO2 gate oxides observed with C-AFM.
1501-1505
Electronic Edition (link) BibTeX
- Joachim C. Reiner:
Pre-breakdown leakage current fluctuations of thin gate oxide.
1507-1512
Electronic Edition (link) BibTeX
- B. Mongellaz, F. Marc, Y. Danto:
Ageing simulation of MOSFET circuit using a VHDL-AMS behavioural modelling: an experimental case study.
1513-1518
Electronic Edition (link) BibTeX
- D. Faure, D. Bru, C. Ali, C. Giret, K. Christensen:
Gate oxide breakdown characterization on 0.13mum CMOS technology.
1519-1523
Electronic Edition (link) BibTeX
- Jan Ackaert, Klara Bessemans, Eddy De Backer:
Charging induced damage by photoconduction through thick inter metal dielectrics.
1525-1529
Electronic Edition (link) BibTeX
- Hamid Toutah, Boubekeur Tala-Ighil, Jean-François Llibre, B. Boudart, Taieb Mohammed-Brahim, Olivier Bonnaud:
Degradation in polysilicon thin film transistors related to the quality of the polysilicon material.
1531-1535
Electronic Edition (link) BibTeX
- S. Trinh, Markus P. J. Mergens, Koen G. Verhaege, Christian C. Russ, John Armer, Phillip Jozwiak, Bart Keppens, Russ Mohn, G. Taylor, Frederic De Ranter:
Multi-finger turn-on circuits and design techniques for enhanced ESD performance and width scaling.
1537-1543
Electronic Edition (link) BibTeX
- Masashi Hayashi, Shinji Nakano, Tetsuaki Wada:
Dependence of copper interconnect electromigration phenomenon on barrier metal materials.
1545-1550
Electronic Edition (link) BibTeX
- M. Zecri, P. Besse, P. Givelin, M. Nayrolles, M. Bafleur, N. Nolhier:
Determination of the ESD Failure Cause Through its Signature.
1551-1556
Electronic Edition (link) BibTeX
- V. Dubec, Scrgey Bychikhin, M. Blaho, Dionyz Pogany, E. Gornik, J. Willemen, N. Qu, Wolfgang Wilkening, L. Zullino, A. Andreini:
A dual-beam Michelson interferometer for investigation of trigger dynamics in ESD protection devices under very fast TLP stress.
1557-1561
Electronic Edition (link) BibTeX
- Abdellatif Firiti, D. Faujour, G. Haller, J. M. Moragues, V. Goubier, Philippe Perdu, Felix Beaudoin, D. Lewis:
Short defect characterization based on TCR parameter extraction.
1563-1568
Electronic Edition (link) BibTeX
- M. S. B. Sowariraj, Theo Smedes, Cora Salm, Ton J. Mouthaan, Fred G. Kuper:
Role of package parasitics and substrate resistance on the Charged Device Model (CDM) failure levels -An explanation and die protection strategy.
1569-1575
Electronic Edition (link) BibTeX
- T. Beauchêne, D. Trémouilles, D. Lewis, Philippe Perdu, P. Fouillat:
Characterization of ESD induced defects using Photovoltaic Laser Stimulation (PLS).
1577-1582
Electronic Edition (link) BibTeX
- Wen-Yu Lo, Ming-Dou Ker:
Analysis and Prevention on NC-ball induced ESD Damages in a 683-Pin BGA Packaged Chipset IC.
1583-1588
Electronic Edition (link) BibTeX
- Gaudenzio Meneghesso, N. Novembre, Enrico Zanoni, L. Sponton, L. Cerati, G. Croce:
Optimization of ESD protection structures suitable for BCD6 smart power technology.
1589-1594
Electronic Edition (link) BibTeX
- J. C. H. Phang, D. S. H. Chan, V. K. S. Ong, S. Kolachina, J. M. Chin, M. Palaniappan, G. Gilfeather, Y. X. Seah:
Single contact beam induced current phenomenon for microelectronic failure analysis.
1595-1602
Electronic Edition (link) BibTeX
- Franco Stellari, Peilin Song, Moyra K. McManus, Alan J. Weger, Robert Gauthier, Kiran V. Chatty, Mujahid Muhammad, Pia Sanda, Philip Wu, Steve Wilson:
Latchup Analysis Using Emission Microscopy.
1603-1608
Electronic Edition (link) BibTeX
- Stefan Dilhaire, M. Amine Salhi, Stéphane Grauby, Wilfrid Claeys:
Laser Seebeck Effect Imaging (SEI) and Peltier Effect Imaging (PEI): complementary investigation methods.
1609-1613
Electronic Edition (link) BibTeX
- F. Darracq, Hervé Lapuyade, N. Buard, P. Fouillat, R. Dufayel, T. Carriere:
Low-cost backside laser test method to pre-characterize the COTS IC's sensitivity to Single Event Effects.
1615-1619
Electronic Edition (link) BibTeX
- P. LeCoupanec, William K. Lo, Keneth R. Wilsher:
An ultra-low dark-count and jitter, superconducting, single-photon detector for emission timing analysis of integrated circuits.
1621-1626
Electronic Edition (link) BibTeX
- Katsuyoshi Miura, Tomoyuki Kobatake, Koji Nakamae, Hiromu Fujioka:
A low energy FIB processing, repair, and test system.
1627-1631
Electronic Edition (link) BibTeX
- F. Seifert, R. Weber, W. Mertin, E. Kubalek:
A new technique for contactless current contrast imaging of high frequency signals.
1633-1638
Electronic Edition (link) BibTeX
- M. Remmach, Romain Desplats, Felix Beaudoin, E. Frances, Philippe Perdu, D. Lewis:
Time Resolved Photoemission (PICA) - From the Physics to Practical Considerations.
1639-1644
Electronic Edition (link) BibTeX
- Hervé Deslandes, T. R. Lundquist:
Limitations to photon-emission microscopy when applied to "hot" devices.
1645-1650
Electronic Edition (link) BibTeX
- Maria Stangoni, Mauro Ciappa, Wolfgang Fichtner:
A New Procedure to Define the Zero-Field Condition and to Delineate pn-Junctions in Silicon Devices by Scanning Capacitance Microscopy.
1651-1656
Electronic Edition (link) BibTeX
- L. A. Knauss, A. Orozco, S. I. Woods, A. B. Cawthorne:
Advances in scanning SQUID microscopy for die-level and package-level fault isolation.
1657-1662
Electronic Edition (link) BibTeX
- Romain Desplats, A. Eral, Felix Beaudoin, Philippe Perdu, Alan J. Weger, Moyra K. McManus, Peilin Song, Franco Stellari:
Faster IC Analysis with PICA Spatial Temporal Photon Correlation and CAD Autochanneling.
1663-1668
Electronic Edition (link) BibTeX
- Alberto Tosi, Franco Stellari, F. Zappa, S. Cova:
Backside Flip-Chip testing by means of high-bandwidth luminescence detection.
1669-1674
Electronic Edition (link) BibTeX
- B. Simmnacher, R. Weiland, J. Höhne, F. v. Feilitzsch, C. Hollerith:
Semiconductor material analysis based on microcalorimeter EDS.
1675-1680
Electronic Edition (link) BibTeX
- Felix Beaudoin, Romain Desplats, Philippe Perdu, Abdellatif Firiti, G. Haller, V. Pouget, D. Lewis:
From Static Thermal and Photoelectric Laser Stimulation (TLS/PLS) to Dynamic Laser Testing.
1681-1686
Electronic Edition (link) BibTeX
- Jon C. Lee, J. H. Chuang:
A Novel Application of C-AFM: Deep Sub-micron Single Probing for IC Failure Analysis.
1687-1692
Electronic Edition (link) BibTeX
- Paul-Henri Albarède, S. Lavagne, C. Grosjean:
Strain investigation around shallow trench isolations : a LACBED Study.
1693-1698
Electronic Edition (link) BibTeX
- N. Lucarelli, M. Cavone, M. Muschitiello, D. Centrone, F. Corsi:
Thermally Induced Voltage Alteration (TIVA) applied to ESD induced failures.
1699-1704
Electronic Edition (link) BibTeX
- S. L. Delage, C. Dua:
Wide band gap semiconductor reliability : Status and trends.
1705-1712
Electronic Edition (link) BibTeX
- A. Curutchet, N. Malbert, N. Labat, A. Touboul, C. Gaquière, A. Minko, M. Uren:
Low frequency drain noise comparison of AlGaN/GaN HEMT's grown on silicon, SiC and sapphire substrates.
1713-1718
Electronic Edition (link) BibTeX
- J. Kuchenbecker, M. Borgarino, M. Zeuner, U. König, R. Plana, Fausto Fantini:
High Electric Field Induced Degradation of the DC Characteristics in Si/SiGe HEMT's.
1719-1723
Electronic Edition (link) BibTeX
- J. C. Martin, C. Maneux, N. Labat, A. Touboul, Muriel Riet, S. Blayac, M. Kahn, Jean Godin:
1/f noise analysis of InP/InGaAs DHBTs submitted to bias and thermal stresses.
1725-1730
Electronic Edition (link) BibTeX
- M. Belhaj, C. Maneux, N. Labat, A. Touboul, P. Bove:
High current effects in InP/GaAsSb/InP DHBT: Physical mechanisms and parasitic effects.
1731-1736
Electronic Edition (link) BibTeX
- Gaudenzio Meneghesso, S. Levada, Enrico Zanoni, G. Scamarcio, G. Mura, Simona Podda, Massimo Vanzi, S. Du, I. Eliashevich:
Reliability of visible GaN LEDs in plastic package.
1737-1742
Electronic Edition (link) BibTeX
- L. Mendizabal, Jean-Louis Verneuil, L. Béchou, Christelle Aupetit-Berthelemot, Y. Deshayes, F. Verdier, Jean-Michel Dumas, Y. Danto, D. Laffitte, J. L. Goudard:
Impact of 1.55 mum laser diode degradation laws on fibre optic system performances using a system simulator.
1743-1749
Electronic Edition (link) BibTeX
- J. Van de Casteele, D. Laffitte, G. Gelly, C. Starck, M. Bettiati:
High reliability level demonstrated on 980nm laser diode.
1751-1754
Electronic Edition (link) BibTeX
- Kevin Sanchez, Romain Desplats, G. Perez, V. Pichetto, Felix Beaudoin, Philippe Perdu:
Solar Cell Analysis with Light Emission and OBIC Techniques.
1755-1760
Electronic Edition (link) BibTeX
- C. Gautier, J. Périnet, E. Nissou, D. Laffitte:
New method of qualification applied to optical amplifier with electronics.
1761-1766
Electronic Edition (link) BibTeX
- J. L. Goudard, X. Boddaert, J. Périnet, D. Laffitte:
Reliability of optoelectronics components: towards new qualification practices.
1767-1769
Electronic Edition (link) BibTeX
- G. Mura, Massimo Vanzi, Maria Stangoni, Mauro Ciappa, Wolfgang Fichtner:
On the behaviour of the selective iodine-based gold etch for the failure analysis of aged optoelectronic devices.
1771-1776
Electronic Edition (link) BibTeX
- G. Q. Zhang:
The challenges of virtual prototyping and qualification for future microelectronics.
1777-1783
Electronic Edition (link) BibTeX
- P. Soussan, G. Lekens, R. Dreesen, Ward De Ceuninck, E. Beyne:
Advantage of In-situ over Ex-situ techniques as reliability tool: Aging kinetics of Imec's MCM-D discrete passives devices.
1785-1790
Electronic Edition (link) BibTeX
- P. Tropea, A. Mellal, J. Botsis:
Deformation and damage of a solder-copper joint.
1791-1796
Electronic Edition (link) BibTeX
- A. B. Horsfall, J. M. M. dos Santos, S. M. Soare, N. G. Wright, A. G. O'Neill, S. J. Bull, A. J. Walton, A. M. Gundlach, J. T. M. Stevenson:
Direct measurement of residual stress in integrated circuit interconnect features.
1797-1801
Electronic Edition (link) BibTeX
- G. Andriamonje, V. Pouget, Y. Ousten, D. Lewis, Y. Danto, J. M. Rampnoux, Y. Ezzahri, Stefan Dilhaire, Stéphane Grauby, Wilfrid Claeys:
Application of Picosecond Ultrasonics to Non-Destructive Analysis in VLSI circuits.
1803-1807
Electronic Edition (link) BibTeX
- O. Crépel, Romain Desplats, Y. Bouttement, Philippe Perdu, C. Goupil, Ph. Descamps, Felix Beaudoin, L. Marina:
Magnetic emission mapping for passive integrated components characterisation.
1809-1814
Electronic Edition (link) BibTeX
- P. Rajamand, R. Tilgner, R. Schmidt, J. Baumann, P. Klofac, M. Rothenfusser:
Investigation of delaminations during thermal stress: scanning acoustic microscopy covering low and high temperatures.
1815-1820
Electronic Edition (link) BibTeX
- David Dalleau, Kirsten Weide-Zaage, Yves Danto:
Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures.
1821-1826
Electronic Edition (link) BibTeX
- M. Krüger, J. Krinke, K. Ritter, B. Zierle, M. Weber:
Laser-assisted decapsulation of plastic-encapsulated devices.
1827-1831
Electronic Edition (link) BibTeX
- G. Lefranc, B. Weiss, C. Klos, J. Dick, G. Khatibi, H. Berg:
Aluminum bond-wire properties after 1 billion mechanical cycles.
1833-1838
Electronic Edition (link) BibTeX
- W. Kanert, H. Dettmer, B. Plikat, N. Seliger:
Reliability aspects of semiconductor devices in high temperature applications.
1839-1846
Electronic Edition (link) BibTeX
- F. Velardi, F. Iannuzzo, G. Busatto, J. Wyss, A. Sanseverino, A. Candelori, G. Currò, A. Cascio, F. Frisina:
Reliability of Medium Blocking Voltage Power VDMOSFET in Radiation Environment.
1847-1851
Electronic Edition (link) BibTeX
- Alexandrine Guédon, Eric Woirgard, Christian Zardini, Guillaume Simon:
Methodology to evaluate the correspondence between real conditions and accelerated tests of a thyristor system used in a power plant.
1853-1858
Electronic Edition (link) BibTeX
- E. Hornung, U. Scheuermann:
Reliability of low current electrical spring contacts in power modules.
1859-1864
Electronic Edition (link) BibTeX
- Yannick Rey-Tauriac, O. de Sagazan, M. Taurin, Olivier Bonnaud:
Robustness improvement of VDMOS transistors in Bipolar/CMOS/DMOS technology.
1865-1869
Electronic Edition (link) BibTeX
- G. Coquery, G. Lefranc, T. Licht, R. Lallemand, N. Seliger, H. Berg:
High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC.
1871-1876
Electronic Edition (link) BibTeX
- Alberto Castellazzi, V. Kartal, R. Kraus, N. Seliger, Martin Honsberg-Riedl, Doris Schmitt-Landsiedel:
Hot-Spot Meaurements and Analysis of Electro-Thermal Effects in Low-Voltage Power-MOSFET's.
1877-1882
Electronic Edition (link) BibTeX
- J. Vobecký, P. Hazdra:
Advanced Local Lifetime Control for Higher Reliability of Power Devices.
1883-1888
Electronic Edition (link) BibTeX
- T. Ayalew, Andreas Gehring, J. M. Park, Tibor Grasser, Siegfried Selberherr:
Improving SiC lateral DMOSFET reliability under high field stress.
1889-1894
Electronic Edition (link) BibTeX
- A. Icaza Deckelmann, Gerhard K. M. Wachutka, F. Hirler, J. Krumrey, R. Henninger:
Avalanche breakdown capability of Power DMOS Transistors and the Wunsch-Bell relation.
1895-1900
Electronic Edition (link) BibTeX
- S. Azzopardi, E. Woirgard, J.-M. Vinassa, O. Briat, C. Zardini:
IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power?
1901-1906
Electronic Edition (link) BibTeX
- G. Busatto, F. Iannuzzo, F. Velardi, M. Valentino, G. P. Pepe:
Non-Destructive Detection of Current Distribution in Power Modules based on Pulsed Magnetic Measurement.
1907-1912
Electronic Edition (link) BibTeX
- K. I. Nuttall, O. Buiu, V. V. N. Obreja:
Surface leakage current related failure of power silicon devices operated at high junction temperature.
1913-1918
Electronic Edition (link) BibTeX
- L. Buchaillot:
Feedback of MEMS reliability study on the design stage: a step toward Reliability Aided Design (RAD).
1919-1928
Electronic Edition (link) BibTeX
- Cezary Sydlo, K. Mutamba, L. Divac Krnic, Bastian Mottet, Hans L. Hartnagel:
Reliability studies on integrated GaAs power-sensor structures using pulsed electrical stress.
1929-1933
Electronic Edition (link) BibTeX
- I. Boyer Heard, R. Coquillé, D. Rivière, P.-Y. Klimonda:
Characterization and reliability of a switch matrix based on MOEMS technology.
1935-1937
Electronic Edition (link) BibTeX
- A. Tetelin, C. Pellet, J.-Y. Delétage, B. Carbonne, Y. Danto:
Moisture diffusion in BCB resins used for MEMS packaging.
1939-1944
Electronic Edition (link) BibTeX
- Sylvaine Muratet, Jean-Yves Fourniols, G. Soto-Romero, Aitor Endemaño Isasi, A. Marty, Marc P. Y. Desmulliez:
MEMS reliability modelling methodology: application to wobble micromotor failure analysis.
1945-1949
Electronic Edition (link) BibTeX
- Guillaume Marinier, Stefan Dilhaire, Luis David Patiño Lopez, Mohamed Benzohra:
Determination of passive SiO2-Au microstructure resonant frequencies.
1951-1955
Electronic Edition (link) BibTeX
Volume 43,
Number 12,
December 2003
- Clemens J. M. Lasance:
Thermally driven reliability issues in microelectronic systems: status-quo and challenges.
1969-1974
Electronic Edition (link) BibTeX
- Glenn A. Rinne:
Issues in accelerated electromigration of solder bumps.
1975-1980
Electronic Edition (link) BibTeX
- Hongguo Zhang, Pant Gurang, Nihdi Sigh, Quvdo Manuel, Robert Wallace, Bruce Gnade, Kevin Stokes:
The effect of small-signal AC voltages on C-V characterization and parameter extraction of SiO2 thin films.
1981-1985
Electronic Edition (link) BibTeX
- X. A. Cao, P. M. Sandvik, S. F. LeBoeuf, S. D. Arthur:
Defect generation in InGaN/GaN light-emitting diodes under forward and reverse electrical stresses.
1987-1991
Electronic Edition (link) BibTeX
- Y. S. Roh, A. Asiz, W. P. Zhang, Y. Xi:
Experimental study and theoretical prediction of aging induced frequency shift of crystal resonators and oscillators.
1993-2000
Electronic Edition (link) BibTeX
- Han-Chang Tsai:
Reliable study of digital IC circuits with margin voltage among variable DC power supply, electromagnetic interference and conducting wire antenna.
2001-2009
Electronic Edition (link) BibTeX
- W. Dauksher, W. S. Burton:
An examination of the applicability of the DNP metric on first level reliability assessments in underfilled electronic packages.
2011-2020
Electronic Edition (link) BibTeX
- Hua Ye, Douglas C. Hopkins, Cemal Basaran:
Measurement of high electrical current density effects in solder joints.
2021-2029
Electronic Edition (link) BibTeX
- M. N. Islam, Y. C. Chan, A. Sharif, M. O. Alam:
Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy.
2031-2037
Electronic Edition (link) BibTeX
- Y. F. Yao, T. Y. Lin, K. H. Chua:
Improving the deflection of wire bonds in stacked chip scale package (CSP).
2039-2045
Electronic Edition (link) BibTeX
- Insu Jeon, Qwanho Chung:
The study on failure mechanisms of bond pad metal peeling: Part A--Experimental investigation.
2047-2054
Electronic Edition (link) BibTeX
- Insu Jeon:
The study on failure mechanisms of bond pad metal peeling: Part B--Numerical analysis.
2055-2064
Electronic Edition (link) BibTeX
- Kazuto Nishida, Kazumichi Shimizu, Michiro Yoshino, Hideo Koguchi, Nipon Taweejun:
Reliability evaluation of ultra-thin CSP using new flip-chip bonding technology--double-sided CSP and single-sided CSP.
2065-2075
Electronic Edition (link) BibTeX
- Mohammad Yunus, K. Srihari, J. M. Pitarresi, Anthony Primavera:
Effect of voids on the reliability of BGA/CSP solder joints.
2077-2086
Electronic Edition (link) BibTeX
- E. H. Wong, Ranjan Rajoo:
Moisture absorption and diffusion characterisation of packaging materials--advanced treatment.
2087-2096
Electronic Edition (link) BibTeX
Copyright © Sun May 17 00:14:12 2009
by Michael Ley (ley@uni-trier.de)
