C. C. Liao

2003
2	EE	J. D. Wu, C. Y. Huang, C. C. Liao: Fracture strength characterization and failure analysis of silicon dies. Microelectronics Reliability 43(2): 269-277 (2003)
2002
1	EE	J. D. Wu, S. H. Ho, C. Y. Huang, C. C. Liao, P. J. Zheng, S. C. Hung: Board level reliability of a stacked CSP subjected to cyclic bending. Microelectronics Reliability 42(3): 407-416 (2002)

Coauthor Index

1	S. H. Ho	[1]
2	C. Y. Huang	[1] [2]
3	S. C. Hung	[1]
4	J. D. Wu	[1] [2]
5	P. J. Zheng	[1]