| 2007 |
|---|
| 6 | EE | Chang-Chun Lee,
Chien-Chen Lee,
Hsiao-Tung Ku,
Shu-Ming Chang,
Kuo-Ning Chiang:
Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology.
Microelectronics Reliability 47(2-3): 196-204 (2007) |
| 2006 |
|---|
| 5 | EE | Kuo-Ming Chen,
J. D. Wu,
Kuo-Ning Chiang:
Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration.
Microelectronics Reliability 46(12): 2104-2111 (2006) |
| 4 | EE | Kuo-Ming Chen,
Kuo-Hsiung Houng,
Kuo-Ning Chiang:
Thermal resistance analysis and validation of flip chip PBGA packages.
Microelectronics Reliability 46(2-4): 440-448 (2006) |
| 3 | EE | Chih-Tang Peng,
Chia-Tai Kuo,
Kuo-Ning Chiang,
Terry Ku,
Kenny Chang:
Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip.
Microelectronics Reliability 46(2-4): 523-534 (2006) |
| 2004 |
|---|
| 2 | EE | Chia-Tai Kuo,
Ming-Chuen Yip,
Kuo-Ning Chiang:
Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application.
Microelectronics Reliability 44(4): 627-638 (2004) |
| 2003 |
|---|
| 1 | EE | Kuo-Ming Chen,
Kuo-Ning Chiang:
Impact of probing procedure on flip chip reliability.
Microelectronics Reliability 43(1): 123-130 (2003) |
