H. S. Liu

2003
1	EE	D. S. Liu, Y. C. Chao, C. H. Lin, G. S. Shen, H. S. Liu: Numerical study on the bonding tool position, tip profile and planarity angle influences on TAB/ILB interconnection reliability. Microelectronics Reliability 43(6): 935-943 (2003)

Coauthor Index

1	Y. C. Chao	[1]
2	C. H. Lin	[1]
3	D. S. Liu	[1]
4	G. S. Shen	[1]