| 2007 |
|---|
| 4 | EE | Ryo Takigawa,
Eiji Higurashi,
Tadatomo Suga,
Satoshi Shinada,
Tetsuya Kawanishi:
Low-Temperature Au-to-Au Bonding for LiNbO3/Si Structure Achieved in Ambient Air.
IEICE Transactions 90-C(1): 145-146 (2007) |
| 2003 |
|---|
| 3 | EE | Kenichi Kataoka,
Toshihiro Itoh,
Tadatomo Suga:
Low Contact-Force Fritting Probe Card Using Buckling Microcantilevers.
ITC 2003: 1008-1013 |
| 2 | EE | Qian Wang,
Naoe Hosoda,
Toshihiro Itoh,
Tadatomo Suga:
Reliability of Au bump-Cu direct interconnections fabricated by means of surface activated bonding method.
Microelectronics Reliability 43(5): 751-756 (2003) |
| 2002 |
|---|
| 1 | EE | Kenichi Kataoka,
Toshihiro Itoh,
Katsuya Okumura,
Tadatomo Suga:
Low-Contact-Force Probing on Copper Electrodes.
ITC 2002: 424-429 |
