Harry K. Charles Jr.

2003
3	EE	Harry K. Charles Jr., K. J. Mach, S. J. Lehtonen, Arthur S. Francomacaro, J. S. DeBoy, R. L. Edwards: Wirebonding at higher ultrasonic frequencies: reliability and process implications. Microelectronics Reliability 43(1): 141-153 (2003)
2001
2	EE	Deborah M. Mechtel, Harry K. Charles Jr., Arthur S. Francomacaro: The development of poled polyimide dielectric layers for simultaneous testing and light guiding applications in MCM-Ds. Microelectronics Reliability 41(11): 1847-1855 (2001)
1	EE	Harry K. Charles Jr.: Tradeoffs in multichip module yield and cost with known good die probability and repair. Microelectronics Reliability 41(5): 715-733 (2001)

Coauthor Index

1	J. S. DeBoy	[3]
2	R. L. Edwards	[3]
3	Arthur S. Francomacaro	[2] [3]
4	S. J. Lehtonen	[3]
5	K. J. Mach	[3]
6	Deborah M. Mechtel	[2]