| 2006 |
|---|
| 6 | EE | J. D. Wu,
P. J. Zheng,
C. W. Lee,
S. C. Hung,
J. J. Lee:
A study in flip-chip UBM/bump reliability with effects of SnPb solder composition.
Microelectronics Reliability 46(1): 41-52 (2006) |
| 5 | EE | Kuo-Ming Chen,
J. D. Wu,
Kuo-Ning Chiang:
Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration.
Microelectronics Reliability 46(12): 2104-2111 (2006) |
| 2003 |
|---|
| 4 | EE | J. D. Wu,
C. Y. Huang,
C. C. Liao:
Fracture strength characterization and failure analysis of silicon dies.
Microelectronics Reliability 43(2): 269-277 (2003) |
| 3 | EE | Po-Jen Zheng,
J. Z. Lee,
K. H. Liu,
J. D. Wu,
S. C. Hung:
Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls.
Microelectronics Reliability 43(6): 925-934 (2003) |
| 2002 |
|---|
| 2 | EE | J. D. Wu,
S. H. Ho,
C. Y. Huang,
C. C. Liao,
P. J. Zheng,
S. C. Hung:
Board level reliability of a stacked CSP subjected to cyclic bending.
Microelectronics Reliability 42(3): 407-416 (2002) |
| 2001 |
|---|
| 1 | EE | S. C. Hung,
P. J. Zheng,
S. H. Ho,
S. C. Lee,
H. N. Chen,
J. D. Wu:
Board level reliability of PBGA using flex substrate.
Microelectronics Reliability 41(5): 677-687 (2001) |
