| |
| 2003 | ||
|---|---|---|
| 1 | EE | J. H. Zhang, Y. C. Chan, M. O. Alam, S. Fu: Contact resistance and adhesion performance of ACF interconnections to aluminum metallization. Microelectronics Reliability 43(8): 1303-1310 (2003) |
| 1 | M. O. Alam | [1] |
| 2 | Y. C. Chan | [1] |
| 3 | J. H. Zhang | [1] |