| 2008 |
|---|
| 7 | EE | K. I. Sinclair,
T. Tilford,
Marc Y. P. Desmulliez,
G. Goussetis,
C. Bailey,
K. Parrott,
A. J. Sangster:
Open Ended Microwave Oven for Packaging
CoRR abs/0805.0943: (2008) |
| 2007 |
|---|
| 6 | EE | D. Napoletani,
D. C. Struppa,
T. Sauer,
V. Morozov,
N. Vsevolodov,
C. Bailey:
Functional dissipation microarrays for classification.
Pattern Recognition 40(12): 3393-3400 (2007) |
| 2006 |
|---|
| 5 | EE | D. Napoletani,
D. C. Struppa,
T. Sauer,
V. Morozov,
N. Vsevolodov,
C. Bailey:
Functional dissipation microarrays for classification
CoRR abs/physics/0603002: (2006) |
| 2005 |
|---|
| 4 | EE | M. J. Rizvi,
Y. C. Chan,
C. Bailey,
H. Lu:
Study of anisotropic conductive adhesive joint behavior under 3-point bending.
Microelectronics Reliability 45(3-4): 589-596 (2005) |
| 2004 |
|---|
| 3 | EE | Marjorie Skubic,
Samuel Blisard,
C. Bailey,
J. A. Adams,
Pascal Matsakis:
Qualitative analysis of sketched route maps: translating a sketch into linguistic descriptions.
IEEE Transactions on Systems, Man, and Cybernetics, Part B 34(2): 1275-1282 (2004) |
| 2003 |
|---|
| 2 | EE | C. Y. Yin,
M. O. Alam,
Y. C. Chan,
C. Bailey,
Hua Lu:
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications.
Microelectronics Reliability 43(4): 625-633 (2003) |
| 2002 |
|---|
| 1 | EE | Hua Lu,
K. C. Hung,
S. Stoyanov,
C. Bailey,
Y. C. Chan:
No-flow underfill flip chip assembly--an experimental and modeling analysis.
Microelectronics Reliability 42(8): 1205-1212 (2002) |
