| 2003 |
|---|
| 3 | EE | A. Andreini,
C. Neva,
L. Renard,
G. Sironi,
F. Speroni,
L. Sponton,
F. Tampellini,
R. Tiziani:
Pad Over Active (POA) solutions for three metal level BCD5 mixed power process - Design and validation of ESD protections.
Microelectronics Reliability 43(9-11): 1377-1382 (2003) |
| 2002 |
|---|
| 2 | EE | C. Passagrilli,
L. Gobbato,
R. Tiziani:
Reliability of Au/Al bonding in plastic packages for high temperature (200degreeC) and high current applications.
Microelectronics Reliability 42(9-11): 1523-1528 (2002) |
| 1 | EE | R. Tiziani,
G. Passoni,
G. Santospirito:
Adhesive die attach for power application: Performance and reliability in plastic package.
Microelectronics Reliability 42(9-11): 1611-1616 (2002) |
