| 2006 |
|---|
| 13 | EE | Marco Buzzo,
Mauro Ciappa,
Wolfgang Fichtner:
Characterization of photonic devices by secondary electron potential contrast.
Microelectronics Reliability 46(9-11): 1536-1541 (2006) |
| 12 | EE | Alberto Castellazzi,
Mauro Ciappa,
Wolfgang Fichtner,
G. Lourdel,
Michel Mermet-Guyennet:
Compact modelling and analysis of power-sharing unbalances in IGBT-modules used in traction applications.
Microelectronics Reliability 46(9-11): 1754-1759 (2006) |
| 11 | EE | D. Barlini,
Mauro Ciappa,
Alberto Castellazzi,
Michel Mermet-Guyennet,
Wolfgang Fichtner:
New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions.
Microelectronics Reliability 46(9-11): 1772-1777 (2006) |
| 2005 |
|---|
| 10 | EE | Mauro Ciappa:
Lifetime prediction on the base of mission profiles.
Microelectronics Reliability 45(9-11): 1293-1298 (2005) |
| 9 | EE | Marco Buzzo,
Mauro Ciappa,
Maria Stangoni,
Wolfgang Fichtner:
Two-dimensional Dopant Profiling and Imaging of 4H Silicon Carbide Devices by Secondary Electron Potential Contrast.
Microelectronics Reliability 45(9-11): 1499-1504 (2005) |
| 8 | EE | Maria Stangoni,
Mauro Ciappa,
Wolfgang Fichtner:
Assessment of the Analytical Capabilities of Scanning Capacitance and Scanning Spreading Resistance Microscopy Applied to Semiconductor Devices.
Microelectronics Reliability 45(9-11): 1532-1537 (2005) |
| 7 | EE | Mauro Ciappa,
Wolfgang Fichtner,
T. Kojima,
Y. Yamada,
Y. Nishibe:
Extraction of Accurate Thermal Compact Models for Fast Electro-Thermal Simulation of IGBT Modules in Hybrid Electric Vehicles.
Microelectronics Reliability 45(9-11): 1694-1699 (2005) |
| 2003 |
|---|
| 6 | EE | Maria Stangoni,
Mauro Ciappa,
Wolfgang Fichtner:
A New Procedure to Define the Zero-Field Condition and to Delineate pn-Junctions in Silicon Devices by Scanning Capacitance Microscopy.
Microelectronics Reliability 43(9-11): 1651-1656 (2003) |
| 5 | EE | G. Mura,
Massimo Vanzi,
Maria Stangoni,
Mauro Ciappa,
Wolfgang Fichtner:
On the behaviour of the selective iodine-based gold etch for the failure analysis of aged optoelectronic devices.
Microelectronics Reliability 43(9-11): 1771-1776 (2003) |
| 2002 |
|---|
| 4 | EE | Mauro Ciappa:
Selected failure mechanisms of modern power modules.
Microelectronics Reliability 42(4-5): 653-667 (2002) |
| 3 | EE | Mauro Ciappa,
Flavio Carbognani,
P. Cova,
Wolfgang Fichtner:
A Novel Thermomechanics -Based Lifetime Prediction Model for Cycle Fatigue Failure Mechanisms in Power Semiconductors.
Microelectronics Reliability 42(9-11): 1653-1658 (2002) |
| 2 | EE | Maria Stangoni,
Mauro Ciappa,
Marco Buzzo,
M. Leicht,
Wolfgang Fichtner:
Simulation and Experimental Validation of Scanning Capacitance Microscopy Measurements across Low-doped Epitaxial PN-Junction.
Microelectronics Reliability 42(9-11): 1701-1706 (2002) |
| 2001 |
|---|
| 1 | | H. Yabuhara,
Mauro Ciappa,
Wolfgang Fichtner:
Diamond-Coated Cantilevers for Scanning Capacitance Microscopy Applications.
Microelectronics Reliability 41(9-10): 1459-1463 (2001) |
