| |
| 2003 | ||
|---|---|---|
| 1 | EE | D. S. Liu, Y. C. Chao, C. H. Lin, G. S. Shen, H. S. Liu: Numerical study on the bonding tool position, tip profile and planarity angle influences on TAB/ILB interconnection reliability. Microelectronics Reliability 43(6): 935-943 (2003) |
| 1 | Y. C. Chao | [1] |
| 2 | C. H. Lin | [1] |
| 3 | D. S. Liu | [1] |
| 4 | H. S. Liu | [1] |