| |
| 2004 | ||
|---|---|---|
| 3 | EE | N. H. Yeung, Victor Lau, Y. C. Chan: Bias-HAST on tape ball grid array (TBGA) test pattern. Microelectronics Reliability 44(4): 595-602 (2004) |
| 2003 | ||
| 2 | EE | C. W. Tan, Y. C. Chan, N. H. Yeung: Effect of autoclave test on anisotropic conductive joints. Microelectronics Reliability 43(2): 279-285 (2003) |
| 1 | EE | C. W. Tan, Y. C. Chan, N. H. Yeung: Behaviour of anisotropic conductive joints under mechanical loading. Microelectronics Reliability 43(3): 481-486 (2003) |
| 1 | Y. C. Chan | [1] [2] [3] |
| 2 | Victor Lau | [3] |
| 3 | C. W. Tan | [1] [2] |