R. K. Shiue

2003
2	EE	R. K. Shiue, L. W. Tsay, C. L. Lin, J. L. Ou: The reliability study of selected Sn-Zn based lead-free solders on Au/Ni-P/Cu substrate. Microelectronics Reliability 43(3): 453-463 (2003)
2001
1	EE	W. D. Zhuang, P. C. Chang, F. Y. Chou, R. K. Shiue: Effect of solder creep on the reliability of large area die attachment. Microelectronics Reliability 41(12): 2011-2021 (2001)

Coauthor Index

1	P. C. Chang	[1]
2	F. Y. Chou	[1]
3	C. L. Lin	[2]
4	J. L. Ou	[2]
5	L. W. Tsay	[2]
6	W. D. Zhuang	[1]

Colors in the list of coauthors