2003 | ||
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1 | EE | Kenji Takahashi, Mitsuo Umemoto, Naotaka Tanaka, Kazumasa Tanida, Yoshihiko Nemoto, Yoshihiro Tomita, Masamoto Tago, Manabu Bonkohara: Ultra-high-density interconnection technology of three-dimensional packaging. Microelectronics Reliability 43(8): 1267-1279 (2003) |
1 | Manabu Bonkohara | [1] |
2 | Masamoto Tago | [1] |
3 | Kenji Takahashi | [1] |
4 | Naotaka Tanaka | [1] |
5 | Kazumasa Tanida | [1] |
6 | Yoshihiro Tomita | [1] |
7 | Mitsuo Umemoto | [1] |