| |
| 2005 | ||
|---|---|---|
| 3 | EE | A. Guédon-Gracia, E. Woirgard, C. Zardini: Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability. Microelectronics Reliability 45(9-11): 1652-1657 (2005) |
| 2003 | ||
| 2 | EE | S. Azzopardi, E. Woirgard, J.-M. Vinassa, O. Briat, C. Zardini: IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power? Microelectronics Reliability 43(9-11): 1901-1906 (2003) |
| 2002 | ||
| 1 | EE | P. Guilbault, E. Woirgard, C. Zardini, D. Lambert: Reliability study of the assembly of a large EGA on a build up board using thermo-mechanical simulations. Microelectronics Reliability 42(9-11): 1529-1533 (2002) |
| 1 | S. Azzopardi | [2] |
| 2 | O. Briat | [2] |
| 3 | A. Guédon-Gracia | [3] |
| 4 | P. Guilbault | [1] |
| 5 | D. Lambert | [1] |
| 6 | J.-M. Vinassa | [2] |
| 7 | E. Woirgard | [1] [2] [3] |