| 2007 |
|---|
| 5 | EE | M. A. J. van Gils,
O. van der Sluis,
G. Q. Zhang,
J. H. J. Janssen,
R. M. J. Voncken:
Analysis of Cu/low-k bond pad delamination by using a novel failure index.
Microelectronics Reliability 47(2-3): 179-186 (2007) |
| 4 | EE | D. G. Yang,
K. M. B. Jansen,
L. J. Ernst,
G. Q. Zhang,
H. J. L. Bressers,
J. H. J. Janssen:
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds.
Microelectronics Reliability 47(2-3): 233-239 (2007) |
| 3 | EE | M. A. J. van Gils,
W. D. van Driel,
G. Q. Zhang,
H. J. L. Bressers,
R. B. R. van Silfhout,
X. J. Fan,
J. H. J. Janssen:
Virtual qualification of moisture induced failures of advanced packages.
Microelectronics Reliability 47(2-3): 273-279 (2007) |
| 2 | EE | D. G. Yang,
K. M. B. Jansen,
L. J. Ernst,
G. Q. Zhang,
W. D. van Driel,
H. J. L. Bressers,
J. H. J. Janssen:
Numerical modeling of warpage induced in QFN array molding process.
Microelectronics Reliability 47(2-3): 310-318 (2007) |
| 2003 |
|---|
| 1 | EE | W. D. van Driel,
G. Q. Zhang,
J. H. J. Janssen,
L. J. Ernst,
F. Su,
Kerm Sin Chian,
Sung Yi:
Prediction and verification of process induced warpage of electronic packages.
Microelectronics Reliability 43(5): 765-774 (2003) |
