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Insu Jeon

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2004
4EEKyoungsoon Cho, Insu Jeon: Numerical analysis of the warpage problem in TSOP. Microelectronics Reliability 44(4): 621-626 (2004)
3EEInsu Jeon, Young-Bae Park: Analysis of the reservoir effect on electromigration reliability. Microelectronics Reliability 44(6): 917-928 (2004)
2003
2EEInsu Jeon, Qwanho Chung: The study on failure mechanisms of bond pad metal peeling: Part A--Experimental investigation. Microelectronics Reliability 43(12): 2047-2054 (2003)
1EEInsu Jeon: The study on failure mechanisms of bond pad metal peeling: Part B--Numerical analysis. Microelectronics Reliability 43(12): 2055-2064 (2003)

Coauthor Index

1Kyoungsoon Cho [4]
2Qwanho Chung [2]
3Young-Bae Park [3]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)