2004 | ||
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4 | EE | Kyoungsoon Cho, Insu Jeon: Numerical analysis of the warpage problem in TSOP. Microelectronics Reliability 44(4): 621-626 (2004) |
3 | EE | Insu Jeon, Young-Bae Park: Analysis of the reservoir effect on electromigration reliability. Microelectronics Reliability 44(6): 917-928 (2004) |
2003 | ||
2 | EE | Insu Jeon, Qwanho Chung: The study on failure mechanisms of bond pad metal peeling: Part A--Experimental investigation. Microelectronics Reliability 43(12): 2047-2054 (2003) |
1 | EE | Insu Jeon: The study on failure mechanisms of bond pad metal peeling: Part B--Numerical analysis. Microelectronics Reliability 43(12): 2055-2064 (2003) |
1 | Kyoungsoon Cho | [4] |
2 | Qwanho Chung | [2] |
3 | Young-Bae Park | [3] |