| |
| 2007 | ||
|---|---|---|
| 3 | EE | Kirsten Weide-Zaage, David Dalleau, Yves Danto, Hélène Frémont: Dynamic void formation in a DD-copper-structure with different metallization geometry. Microelectronics Reliability 47(2-3): 319-325 (2007) |
| 2005 | ||
| 2 | EE | Kirsten Weide-Zaage, Walter Horaud, Hélène Frémont: Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations. Microelectronics Reliability 45(9-11): 1662-1667 (2005) |
| 2003 | ||
| 1 | EE | David Dalleau, Kirsten Weide-Zaage, Yves Danto: Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures. Microelectronics Reliability 43(9-11): 1821-1826 (2003) |
| 1 | David Dalleau | [1] [3] |
| 2 | Yves Danto | [1] [3] |
| 3 | Hélène Frémont | [2] [3] |
| 4 | Walter Horaud | [2] |