| 2005 |
|---|
| 7 | EE | H. A. Post,
P. Letullier,
T. Briolat,
R. Humke,
R. Schuhmann,
K. Saarinen,
W. Werner,
Y. Ousten,
G. Lekens,
A. Dehbi:
Failure mechanisms and qualification testing of passive components.
Microelectronics Reliability 45(9-11): 1626-1632 (2005) |
| 6 | EE | A. Dehbi,
Y. Ousten,
Y. Danto,
W. Wondrak:
Vibration lifetime modelling of PCB assemblies using steinberg model.
Microelectronics Reliability 45(9-11): 1658-1661 (2005) |
| 2003 |
|---|
| 5 | EE | G. Andriamonje,
V. Pouget,
Y. Ousten,
D. Lewis,
Y. Danto,
J. M. Rampnoux,
Y. Ezzahri,
Stefan Dilhaire,
Stéphane Grauby,
Wilfrid Claeys:
Application of Picosecond Ultrasonics to Non-Destructive Analysis in VLSI circuits.
Microelectronics Reliability 43(9-11): 1803-1807 (2003) |
| 2002 |
|---|
| 4 | EE | A. Dehbi,
W. Wondrak,
Y. Ousten,
Y. Danto:
High temperature reliability testing of aluminum and tantalum electrolytic capacitors.
Microelectronics Reliability 42(6): 835-840 (2002) |
| 3 | EE | B. Trégon,
Y. Ousten,
Y. Danto,
L. Béchou,
B. Parmentier:
Behavioral study of passive components and coating materials under isostatic pressure and temperature stress conditions.
Microelectronics Reliability 42(7): 1113-1120 (2002) |
| 2 | EE | J. Augereau,
Y. Ousten,
L. Béchou,
Y. Danto:
Acoustic analysis of an assembly: Structural identification by signal processing (wavelets).
Microelectronics Reliability 42(9-11): 1517-1522 (2002) |
| 1 | EE | G. Duchamp,
Y. Ousten,
Y. Danto:
Evaluation of a micropackaging analysis technique by highfrequency microwaves.
Microelectronics Reliability 42(9-11): 1551-1554 (2002) |
