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Bart Vandevelde

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2007
4EEArtur Wymyslowski, Bart Vandevelde, Dag Andersson: Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectronics Reliability 47(2-3): 159-160 (2007)
3EENele Van Steenberge, Paresh Limaye, Geert Willems, Bart Vandevelde, Inge Schildermans: Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly. Microelectronics Reliability 47(2-3): 215-222 (2007)
2EEBart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev, Eric Beyne: Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages. Microelectronics Reliability 47(2-3): 259-265 (2007)
2003
1EEBart Vandevelde, Dominiek Degryse, Eric Beyne, Eric Roose, Dorina Corlatan, Guido Swaelen, Geert Willems, Filip Christiaens, Alcatel Bell, Dirk Vandepitte: Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packages. Microelectronics Reliability 43(2): 307-318 (2003)

Coauthor Index

1Dag Andersson [4]
2Alcatel Bell [1]
3Eric Beyne [1] [2]
4Filip Christiaens [1]
5Dorina Corlatan [1]
6Dominiek Degryse [1]
7Mario Gonzalez [2]
8Paresh Limaye [2] [3]
9Petar Ratchev [2]
10Eric Roose [1]
11Inge Schildermans [3]
12Nele Van Steenberge [3]
13Guido Swaelen [1]
14Dirk Vandepitte [1]
15Geert Willems [1] [3]
16Artur Wymyslowski [4]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)