| 2007 |
|---|
| 4 | EE | Artur Wymyslowski,
Bart Vandevelde,
Dag Andersson:
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems.
Microelectronics Reliability 47(2-3): 159-160 (2007) |
| 3 | EE | Nele Van Steenberge,
Paresh Limaye,
Geert Willems,
Bart Vandevelde,
Inge Schildermans:
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly.
Microelectronics Reliability 47(2-3): 215-222 (2007) |
| 2 | EE | Bart Vandevelde,
Mario Gonzalez,
Paresh Limaye,
Petar Ratchev,
Eric Beyne:
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages.
Microelectronics Reliability 47(2-3): 259-265 (2007) |
| 2003 |
|---|
| 1 | EE | Bart Vandevelde,
Dominiek Degryse,
Eric Beyne,
Eric Roose,
Dorina Corlatan,
Guido Swaelen,
Geert Willems,
Filip Christiaens,
Alcatel Bell,
Dirk Vandepitte:
Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packages.
Microelectronics Reliability 43(2): 307-318 (2003) |
