| 2003 |
|---|
| 4 | EE | G. Lefranc,
B. Weiss,
C. Klos,
J. Dick,
G. Khatibi,
H. Berg:
Aluminum bond-wire properties after 1 billion mechanical cycles.
Microelectronics Reliability 43(9-11): 1833-1838 (2003) |
| 3 | EE | G. Coquery,
G. Lefranc,
T. Licht,
R. Lallemand,
N. Seliger,
H. Berg:
High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC.
Microelectronics Reliability 43(9-11): 1871-1876 (2003) |
| 2002 |
|---|
| 2 | EE | N. Seliger,
E. Wolfgang,
G. Lefranc,
H. Berg,
T. Licht:
Reliable power electronics for automotive applications.
Microelectronics Reliability 42(9-11): 1597-1604 (2002) |
| 1 | EE | G. Lefranc,
T. Licht,
G. Mitic:
Properties of solders and their fatigue in power modules.
Microelectronics Reliability 42(9-11): 1641-1646 (2002) |
