| 2006 |
|---|
| 7 | EE | O. Briat,
W. Lajnef,
J.-M. Vinassa,
E. Woirgard:
Power cycling tests for accelerated ageing of ultracapacitors.
Microelectronics Reliability 46(9-11): 1445-1450 (2006) |
| 6 | EE | A. Benmansour,
S. Azzopardi,
J. C. Martin,
E. Woirgard:
Failure mechanism of trench IGBT under short-circuit after turn-off.
Microelectronics Reliability 46(9-11): 1778-1783 (2006) |
| 2005 |
|---|
| 5 | EE | A. Guédon-Gracia,
E. Woirgard,
C. Zardini:
Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability.
Microelectronics Reliability 45(9-11): 1652-1657 (2005) |
| 4 | EE | S. Azzopardi,
A. Benmansour,
M. Ishiko,
E. Woirgard:
Assessment of the Trench IGBT reliability: low temperature experimental characterization.
Microelectronics Reliability 45(9-11): 1700-1705 (2005) |
| 3 | EE | W. Lajnef,
J.-M. Vinassa,
O. Briat,
E. Woirgard:
Specification and use of pulsed current profiles for ultracapacitors power cycling.
Microelectronics Reliability 45(9-11): 1746-1749 (2005) |
| 2003 |
|---|
| 2 | EE | S. Azzopardi,
E. Woirgard,
J.-M. Vinassa,
O. Briat,
C. Zardini:
IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power?
Microelectronics Reliability 43(9-11): 1901-1906 (2003) |
| 2002 |
|---|
| 1 | EE | P. Guilbault,
E. Woirgard,
C. Zardini,
D. Lambert:
Reliability study of the assembly of a large EGA on a build up board using thermo-mechanical simulations.
Microelectronics Reliability 42(9-11): 1529-1533 (2002) |
