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E. Woirgard

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2006
7EEO. Briat, W. Lajnef, J.-M. Vinassa, E. Woirgard: Power cycling tests for accelerated ageing of ultracapacitors. Microelectronics Reliability 46(9-11): 1445-1450 (2006)
6EEA. Benmansour, S. Azzopardi, J. C. Martin, E. Woirgard: Failure mechanism of trench IGBT under short-circuit after turn-off. Microelectronics Reliability 46(9-11): 1778-1783 (2006)
2005
5EEA. Guédon-Gracia, E. Woirgard, C. Zardini: Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability. Microelectronics Reliability 45(9-11): 1652-1657 (2005)
4EES. Azzopardi, A. Benmansour, M. Ishiko, E. Woirgard: Assessment of the Trench IGBT reliability: low temperature experimental characterization. Microelectronics Reliability 45(9-11): 1700-1705 (2005)
3EEW. Lajnef, J.-M. Vinassa, O. Briat, E. Woirgard: Specification and use of pulsed current profiles for ultracapacitors power cycling. Microelectronics Reliability 45(9-11): 1746-1749 (2005)
2003
2EES. Azzopardi, E. Woirgard, J.-M. Vinassa, O. Briat, C. Zardini: IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power? Microelectronics Reliability 43(9-11): 1901-1906 (2003)
2002
1EEP. Guilbault, E. Woirgard, C. Zardini, D. Lambert: Reliability study of the assembly of a large EGA on a build up board using thermo-mechanical simulations. Microelectronics Reliability 42(9-11): 1529-1533 (2002)

Coauthor Index

1S. Azzopardi [2] [4] [6]
2A. Benmansour [4] [6]
3O. Briat [2] [3] [7]
4A. Guédon-Gracia [5]
5P. Guilbault [1]
6M. Ishiko [4]
7W. Lajnef [3] [7]
8D. Lambert [1]
9J. C. Martin [6]
10J.-M. Vinassa [2] [3] [7]
11C. Zardini [1] [2] [5]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)