| |
| 2003 | ||
|---|---|---|
| 1 | EE | T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu: Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. Microelectronics Reliability 43(5): 803-809 (2003) |
| 1 | J. W. Chai | [1] |
| 2 | K. L. Davison | [1] |
| 3 | W. S. Leong | [1] |
| 4 | T. Y. Lin | [1] |
| 5 | J. S. Pan | [1] |
| 6 | W. C. Tjiu | [1] |
| 7 | K. C. Toh | [1] |
| 8 | Y. F. Yao | [1] |