| 2006 |
|---|
| 4 | EE | P. Zimprich,
T. Licht,
B. Weiss:
A new method to characterize the thermomechanical response of multilayered structures in power electronics.
Microelectronics Reliability 46(9-11): 1844-1847 (2006) |
| 2003 |
|---|
| 3 | EE | G. Coquery,
G. Lefranc,
T. Licht,
R. Lallemand,
N. Seliger,
H. Berg:
High temperature reliability on automotive power modules verified by power cycling tests up to 150degreeC.
Microelectronics Reliability 43(9-11): 1871-1876 (2003) |
| 2002 |
|---|
| 2 | EE | N. Seliger,
E. Wolfgang,
G. Lefranc,
H. Berg,
T. Licht:
Reliable power electronics for automotive applications.
Microelectronics Reliability 42(9-11): 1597-1604 (2002) |
| 1 | EE | G. Lefranc,
T. Licht,
G. Mitic:
Properties of solders and their fatigue in power modules.
Microelectronics Reliability 42(9-11): 1641-1646 (2002) |
