| |
| 2003 | ||
|---|---|---|
| 1 | EE | Harry K. Charles Jr., K. J. Mach, S. J. Lehtonen, Arthur S. Francomacaro, J. S. DeBoy, R. L. Edwards: Wirebonding at higher ultrasonic frequencies: reliability and process implications. Microelectronics Reliability 43(1): 141-153 (2003) |
| 1 | Harry K. Charles Jr. | [1] |
| 2 | J. S. DeBoy | [1] |
| 3 | R. L. Edwards | [1] |
| 4 | Arthur S. Francomacaro | [1] |
| 5 | K. J. Mach | [1] |