| 2003 |
|---|
| 3 | EE | Tong Yan Tee,
Chek Lim Kho,
Daniel Yap,
Carol Toh,
Xavier Baraton,
Zhaowei Zhong:
Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill.
Microelectronics Reliability 43(5): 741-749 (2003) |
| 2 | EE | Tong Yan Tee,
Hun Shen Ng,
Daniel Yap,
Xavier Baraton,
Zhaowei Zhong:
Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications.
Microelectronics Reliability 43(7): 1117-1123 (2003) |
| 1 | EE | Tong Yan Tee,
Hun Shen Ng,
Daniel Yap,
Zhaowei Zhong:
Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages.
Microelectronics Reliability 43(8): 1329-1338 (2003) |
