| 2004 |
|---|
| 6 | EE | Y. P. Wu,
M. O. Alam,
Y. C. Chan,
B. Y. Wu:
Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages.
Microelectronics Reliability 44(2): 295-302 (2004) |
| 5 | EE | M. A. Uddin,
M. O. Alam,
Y. C. Chan,
H. P. Chan:
Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film.
Microelectronics Reliability 44(3): 505-514 (2004) |
| 2003 |
|---|
| 4 | EE | M. N. Islam,
Y. C. Chan,
A. Sharif,
M. O. Alam:
Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy.
Microelectronics Reliability 43(12): 2031-2037 (2003) |
| 3 | EE | C. Y. Yin,
M. O. Alam,
Y. C. Chan,
C. Bailey,
Hua Lu:
The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications.
Microelectronics Reliability 43(4): 625-633 (2003) |
| 2 | EE | J. H. Zhang,
Y. C. Chan,
M. O. Alam,
S. Fu:
Contact resistance and adhesion performance of ACF interconnections to aluminum metallization.
Microelectronics Reliability 43(8): 1303-1310 (2003) |
| 2002 |
|---|
| 1 | EE | M. O. Alam,
Y. C. Chan,
K. C. Hung:
Reliability study of the electroless Ni-P layer against solder alloy.
Microelectronics Reliability 42(7): 1065-1073 (2002) |
