| 2007 |
|---|
| 11 | EE | W. D. van Driel,
A. Mavinkurve,
M. A. J. van Gils,
G. Q. Zhang:
Advanced structural similarity rules for the BGA package family.
Microelectronics Reliability 47(2-3): 205-214 (2007) |
| 10 | EE | M. A. J. van Gils,
W. D. van Driel,
G. Q. Zhang,
H. J. L. Bressers,
R. B. R. van Silfhout,
X. J. Fan,
J. H. J. Janssen:
Virtual qualification of moisture induced failures of advanced packages.
Microelectronics Reliability 47(2-3): 273-279 (2007) |
| 9 | EE | A. Wymyslowski,
W. D. van Driel,
J. van de Peer,
N. Tzannetakis,
G. Q. Zhang:
Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability.
Microelectronics Reliability 47(2-3): 280-289 (2007) |
| 8 | EE | H. J. L. Bressers,
W. D. van Driel,
K. M. B. Jansen,
L. J. Ernst,
G. Q. Zhang:
Correlation between chemistry of polymer building blocks and microelectronics reliability.
Microelectronics Reliability 47(2-3): 290-294 (2007) |
| 7 | EE | D. G. Yang,
K. M. B. Jansen,
L. J. Ernst,
G. Q. Zhang,
W. D. van Driel,
H. J. L. Bressers,
J. H. J. Janssen:
Numerical modeling of warpage induced in QFN array molding process.
Microelectronics Reliability 47(2-3): 310-318 (2007) |
| 6 | EE | J. W. C. de Vries,
M. Y. Jansen,
W. D. van Driel:
On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections.
Microelectronics Reliability 47(2-3): 444-449 (2007) |
| 2006 |
|---|
| 5 | EE | R. L. J. M. Ubachs,
O. van der Sluis,
W. D. van Driel,
G. Q. Zhang:
Multiscale modelling of multilayer substrates.
Microelectronics Reliability 46(9-11): 1472-1477 (2006) |
| 4 | EE | C. Yuan,
W. D. van Driel,
R. B. R. van Silfhout,
O. van der Sluis,
R. A. B. Engelen,
L. J. Ernst,
F. van Keulen,
G. Q. Zhang:
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions.
Microelectronics Reliability 46(9-11): 1679-1684 (2006) |
| 3 | EE | W. D. van Driel,
O. van der Sluis,
D. G. Yang,
R. L. J. M. Ubachs,
C. Zenz,
G. Aflenzer,
G. Q. Zhang:
Reliability modelling for packages in flexible end-products.
Microelectronics Reliability 46(9-11): 1880-1885 (2006) |
| 2005 |
|---|
| 2 | EE | W. D. van Driel,
M. A. J. van Gils,
R. B. R. van Silfhout,
G. Q. Zhang:
Prediction of Delamination Related IC & Packaging Reliability Problems.
Microelectronics Reliability 45(9-11): 1633-1638 (2005) |
| 2003 |
|---|
| 1 | EE | W. D. van Driel,
G. Q. Zhang,
J. H. J. Janssen,
L. J. Ernst,
F. Su,
Kerm Sin Chian,
Sung Yi:
Prediction and verification of process induced warpage of electronic packages.
Microelectronics Reliability 43(5): 765-774 (2003) |
