| 2005 |
|---|
| 3 | EE | Alberto Tosi,
Franco Stellari,
F. Zappa:
Innovative packaging technique for backside optical testing of wire-bonded chips.
Microelectronics Reliability 45(9-11): 1493-1498 (2005) |
| 2 | EE | Franco Stellari,
Peilin Song,
John Hryckowian,
Otto A. Torreiter,
Steve Wilson,
Philip Wu,
Alberto Tosi:
Characterization of a 0.13 mum CMOS Link Chip using Time Resolved Emission (TRE).
Microelectronics Reliability 45(9-11): 1550-1553 (2005) |
| 2003 |
|---|
| 1 | EE | Alberto Tosi,
Franco Stellari,
F. Zappa,
S. Cova:
Backside Flip-Chip testing by means of high-bandwidth luminescence detection.
Microelectronics Reliability 43(9-11): 1669-1674 (2003) |
