| |
| 2003 | ||
|---|---|---|
| 5 | EE | Thomas D. Moore, John L. Jarvis: Thermomechanical deformation of a bimaterial plate--as applied to laminate IC assemblies. Microelectronics Reliability 43(1): 155-162 (2003) |
| 4 | EE | Thomas D. Moore, John L. Jarvis: A simple and fundamental design rule for resisting delamination in bimaterial structures. Microelectronics Reliability 43(3): 487-494 (2003) |
| 3 | EE | Thomas D. Moore, John L. Jarvis: Erratum to "A simple and fundamental design rule for resisting delamination in bimaterial structures" [Microelectronics Reliability 2003;43: 487-494]. Microelectronics Reliability 43(7): 1169 (2003) |
| 2002 | ||
| 2 | EE | Thomas D. Moore, John L. Jarvis: The effects of in-plane orthotropic properties in a multi-chip ball grid array assembly. Microelectronics Reliability 42(6): 943-949 (2002) |
| 2001 | ||
| 1 | EE | Thomas D. Moore, John L. Jarvis: Improved reliability in small multichip ball grid arrays. Microelectronics Reliability 41(3): 461-469 (2001) |
| 1 | John L. Jarvis | [1] [2] [3] [4] [5] |