| 2007 |
|---|
| 8 | EE | Jing-en Luan,
Tong Yan Tee,
Eric Pek,
Chwee Teck Lim,
Zhaowei Zhong:
Dynamic responses and solder joint reliability under board level drop test.
Microelectronics Reliability 47(2-3): 450-460 (2007) |
| 2006 |
|---|
| 7 | EE | Tong Yan Tee,
Hun Shen Ng,
Zhaowei Zhong:
Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA.
Microelectronics Reliability 46(12): 2131-2138 (2006) |
| 2004 |
|---|
| 6 | EE | Tong Yan Tee,
Zhaowei Zhong:
Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis.
Microelectronics Reliability 44(1): 105-114 (2004) |
| 5 | EE | Tong Yan Tee,
Hun Shen Ng,
Chwee Teck Lim,
Eric Pek,
Zhaowei Zhong:
Impact life prediction modeling of TFBGA packages under board level drop test.
Microelectronics Reliability 44(7): 1131-1142 (2004) |
| 2003 |
|---|
| 4 | EE | Tong Yan Tee,
Giovanni Frezza,
Mayhuan Lim,
Hun Shen Ng,
Federico Ziglioli,
Zhaowei Zhong:
Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn.
International Journal of Computational Engineering Science 4(2): 347-350 (2003) |
| 3 | EE | Tong Yan Tee,
Chek Lim Kho,
Daniel Yap,
Carol Toh,
Xavier Baraton,
Zhaowei Zhong:
Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill.
Microelectronics Reliability 43(5): 741-749 (2003) |
| 2 | EE | Tong Yan Tee,
Hun Shen Ng,
Daniel Yap,
Xavier Baraton,
Zhaowei Zhong:
Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications.
Microelectronics Reliability 43(7): 1117-1123 (2003) |
| 1 | EE | Tong Yan Tee,
Hun Shen Ng,
Daniel Yap,
Zhaowei Zhong:
Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages.
Microelectronics Reliability 43(8): 1329-1338 (2003) |
