J. Z. Lee

2003
1	EE	Po-Jen Zheng, J. Z. Lee, K. H. Liu, J. D. Wu, S. C. Hung: Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls. Microelectronics Reliability 43(6): 925-934 (2003)

Coauthor Index

1	S. C. Hung	[1]
2	K. H. Liu	[1]
3	J. D. Wu	[1]
4	Po-Jen Zheng	[1]