| 2006 |
|---|
| 3 | EE | Petar Ratchev,
Serguei Stoukatch,
Bart Swinnen:
Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads.
Microelectronics Reliability 46(8): 1315-1325 (2006) |
| 2003 |
|---|
| 2 | EE | Arun Chandrasekhar,
Steven Brebels,
Serguei Stoukatch,
Eric Beyne,
Walter De Raedt,
Bart Nauwelaers:
The influence of packaging materials on RF performance.
Microelectronics Reliability 43(3): 351-357 (2003) |
| 1 | EE | Hong Meng Ho,
Wai Lam,
Serguei Stoukatch,
Petar Ratchev,
Charles J. Vath,
Eric Beyne:
Direct gold and copper wires bonding on copper.
Microelectronics Reliability 43(6): 913-923 (2003) |
