| |
| 2003 | ||
|---|---|---|
| 2 | EE | S. Forster, T. Lequeu, R. Jérisian: Degradation mechanism of power devices under di/dt thermal shocks: turn-on of a TRIAC in Q3. Microelectronics Reliability 43(1): 89-98 (2003) |
| 2002 | ||
| 1 | EE | S. Moreau, S. Forster, T. Lequeu, R. Jérisian: Influence of the turn-on mechanism on TRIACs' reliability: di/dt thermal fatigue study in Q1 compared to Q2. Microelectronics Reliability 42(9-11): 1663-1666 (2002) |
| 1 | S. Forster | [1] [2] |
| 2 | R. Jérisian | [1] [2] |
| 3 | S. Moreau | [1] |