Y. C. Chan

2008
27	EE	Sachin Kumar, Myra Torres, Y. C. Chan, Michael Pecht: A hybrid prognostics methodology for electronic products. IJCNN 2008: 3479-3485
26	EE	R. Smit, A. L. Brown, Y. C. Chan: Do air pollution emissions and fuel consumption models for roadways include the effects of congestion in the roadway traffic flow? Environmental Modelling and Software 23(10-11): 1262-1270 (2008)
2006
25	EE	Rashed Adnan Islam, Y. C. Chan, W. Jillek, Samia Islam: Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders. Microelectronics Journal 37(8): 705-713 (2006)
2005
24	EE	M. J. Rizvi, Y. C. Chan, C. Bailey, H. Lu: Study of anisotropic conductive adhesive joint behavior under 3-point bending. Microelectronics Reliability 45(3-4): 589-596 (2005)
2004
23	EE	Y. P. Wu, M. O. Alam, Y. C. Chan, B. Y. Wu: Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages. Microelectronics Reliability 44(2): 295-302 (2004)
22	EE	S. C. Tan, Y. C. Chan, Y. W. Chiu, C. W. Tan: Thermal stability performance of anisotropic conductive film at different bonding temperatures. Microelectronics Reliability 44(3): 495-503 (2004)
21	EE	M. A. Uddin, M. O. Alam, Y. C. Chan, H. P. Chan: Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film. Microelectronics Reliability 44(3): 505-514 (2004)
20	EE	N. H. Yeung, Victor Lau, Y. C. Chan: Bias-HAST on tape ball grid array (TBGA) test pattern. Microelectronics Reliability 44(4): 595-602 (2004)
19	EE	Rashed Adnan Islam, Y. C. Chan: Effect of microwave preheating on the bonding performance of flip chip on flex joint. Microelectronics Reliability 44(5): 815-821 (2004)
18	EE	C. W. Tan, Y. C. Chan, H. P. Chan, N. W. Leung, C. K. So: Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging. Microelectronics Reliability 44(5): 823-831 (2004)
2003
17	EE	M. N. Islam, Y. C. Chan, A. Sharif, M. O. Alam: Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy. Microelectronics Reliability 43(12): 2031-2037 (2003)
16	EE	C. W. Tan, Y. C. Chan, N. H. Yeung: Effect of autoclave test on anisotropic conductive joints. Microelectronics Reliability 43(2): 279-285 (2003)
15	EE	C. W. Tan, Y. C. Chan, N. H. Yeung: Behaviour of anisotropic conductive joints under mechanical loading. Microelectronics Reliability 43(3): 481-486 (2003)
14	EE	C. Y. Yin, M. O. Alam, Y. C. Chan, C. Bailey, Hua Lu: The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability 43(4): 625-633 (2003)
13	EE	J. H. Zhang, Y. C. Chan, M. O. Alam, S. Fu: Contact resistance and adhesion performance of ACF interconnections to aluminum metallization. Microelectronics Reliability 43(8): 1303-1310 (2003)
2002
12	EE	Y. W. Chiu, Y. C. Chan, S. M. Lui: Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects. Microelectronics Reliability 42(12): 1945-1951 (2002)
11	EE	C. F. Luk, Y. C. Chan, K. C. Hung: Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies. Microelectronics Reliability 42(3): 381-389 (2002)
10	EE	C. F. Luk, Y. C. Chan, K. C. Hung: Application of adhesive bonding techniques in hard disk drive head assembly. Microelectronics Reliability 42(4-5): 767-777 (2002)
9	EE	M. O. Alam, Y. C. Chan, K. C. Hung: Reliability study of the electroless Ni-P layer against solder alloy. Microelectronics Reliability 42(7): 1065-1073 (2002)
8	EE	S. H. Fan, Y. C. Chan: Effect of misalignment on electrical characteristics of ACF joints for flip chip on flex applications. Microelectronics Reliability 42(7): 1081-1090 (2002)
7	EE	Y. C. Chan, D. Y. Luk: Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature. Microelectronics Reliability 42(8): 1185-1194 (2002)
6	EE	Y. C. Chan, D. Y. Luk: Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure. Microelectronics Reliability 42(8): 1195-1204 (2002)
5	EE	Hua Lu, K. C. Hung, S. Stoyanov, C. Bailey, Y. C. Chan: No-flow underfill flip chip assembly--an experimental and modeling analysis. Microelectronics Reliability 42(8): 1205-1212 (2002)
2001
4	EE	Y. C. Chan, P. L. Tu, K. C. Hung: Study of the self-alignment of no-flow underfill for micro-BGA assembly. Microelectronics Reliability 41(11): 1867-1875 (2001)
3	EE	P. L. Tu, Y. C. Chan, K. C. Hung: Reliability of microBGA assembly using no-flow underfill. Microelectronics Reliability 41(12): 1993-2000 (2001)
2	EE	P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai: Study of micro-BGA solder joint reliability. Microelectronics Reliability 41(2): 287-293 (2001)
1985
1		Y. C. Chan: FORTLOG = Fortran + Logique. SPLT 1985

Coauthor Index

1	M. O. Alam	[9] [13] [14] [17] [21] [23]
2	C. Bailey	[5] [14] [24]
3	A. L. Brown	[26]
4	H. P. Chan	[18] [21]
5	Y. W. Chiu	[12] [22]
6	S. H. Fan	[8]
7	S. Fu	[13]
8	K. C. Hung	[2] [3] [4] [5] [9] [10] [11]
9	M. N. Islam	[17]
10	Rashed Adnan Islam	[19] [25]
11	Samia Islam	[25]
12	W. Jillek	[25]
13	Sachin Kumar	[27]
14	J. K. L. Lai	[2]
15	Victor Lau	[20]
16	N. W. Leung	[18]
17	H. Lu	[24]
18	Hua Lu	[5] [14]
19	S. M. Lui	[12]
20	C. F. Luk	[10] [11]
21	D. Y. Luk	[6] [7]
22	Michael Pecht	[27]
23	M. J. Rizvi	[24]
24	A. Sharif	[17]
25	R. Smit	[26]
26	C. K. So	[18]
27	S. Stoyanov	[5]
28	C. W. Tan	[15] [16] [18] [22]
29	S. C. Tan	[22]
30	Myra Torres	[27]
31	P. L. Tu	[2] [3] [4]
32	M. A. Uddin	[21]
33	B. Y. Wu	[23]
34	Y. P. Wu	[23]
35	N. H. Yeung	[15] [16] [20]
36	C. Y. Yin	[14]
37	J. H. Zhang	[13]

Colors in the list of coauthors