| 2007 |
|---|
| 11 | EE | Eric Beyne:
Tutorial T7A: Advanced IC Packaging.
VLSI Design 2007: 10 |
| 10 | EE | Bart Vandevelde,
Mario Gonzalez,
Paresh Limaye,
Petar Ratchev,
Eric Beyne:
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages.
Microelectronics Reliability 47(2-3): 259-265 (2007) |
| 2006 |
|---|
| 9 | EE | J. Balachandran,
Steven Brebels,
G. Carchon,
T. Webers,
Walter De Raedt,
Bart Nauwelaers,
Eric Beyne:
Analysis and modeling of power grid transmission lines.
DATE 2006: 33-38 |
| 8 | EE | J. Balachandran,
Steven Brebels,
G. Carchon,
Walter De Raedt,
Eric Beyne,
M. Kuijk,
Bart Nauwelaers:
Constant Impedance Scaling Paradigm for Scaling LC transmission lines.
ISQED 2006: 387-392 |
| 7 | EE | J. Balachandran,
Steven Brebels,
G. Carchon,
M. Kuijk,
Walter De Raedt,
Bart Nauwelaers,
Eric Beyne:
Constant impedance scaling paradigm for interconnect synthesis.
SLIP 2006: 99-105 |
| 6 | EE | J. Balachandran,
Steven Brebels,
G. Carchon,
M. Kuijk,
Walter De Raedt,
Bart Nauwelaers,
Eric Beyne:
Wafer-level package interconnect options.
IEEE Trans. VLSI Syst. 14(6): 654-659 (2006) |
| 2005 |
|---|
| 5 | EE | J. Balachandran,
Steven Brebels,
G. Carchon,
T. Webers,
Walter De Raedt,
Bart Nauwelaers,
Eric Beyne:
Package level interconnect options.
SLIP 2005: 21-27 |
| 2003 |
|---|
| 4 | EE | Bart Vandevelde,
Dominiek Degryse,
Eric Beyne,
Eric Roose,
Dorina Corlatan,
Guido Swaelen,
Geert Willems,
Filip Christiaens,
Alcatel Bell,
Dirk Vandepitte:
Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packages.
Microelectronics Reliability 43(2): 307-318 (2003) |
| 3 | EE | Arun Chandrasekhar,
Steven Brebels,
Serguei Stoukatch,
Eric Beyne,
Walter De Raedt,
Bart Nauwelaers:
The influence of packaging materials on RF performance.
Microelectronics Reliability 43(3): 351-357 (2003) |
| 2 | EE | Hong Meng Ho,
Wai Lam,
Serguei Stoukatch,
Petar Ratchev,
Charles J. Vath,
Eric Beyne:
Direct gold and copper wires bonding on copper.
Microelectronics Reliability 43(6): 913-923 (2003) |
| 1995 |
|---|
| 1 | EE | C. Truzzi,
Eric Beyne,
E. Ringoot,
J. Peeters:
Signal propagation in high-speed MCM circuits.
ICCD 1995: 12-17 |
