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T. Y. Lin

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2008
16EET. Y. Lin, A. Zadeh: Foreword to the Special Section on Granular Computing. IEEE T. Fuzzy Systems 16(2): 282-284 (2008)
2007
15EEXinying Xu, Gaowei Yan, Keming Xie, T. Y. Lin: Immune Evolution Algorithm Based Dynamic Path Planning Approach for the Soccer Robot. GrC 2007: 477-480
14EEJun Xie, Gaowei Yan, Keming Xie, T. Y. Lin: Neuro-Fuzzy Model-Based CUSUM Method Application in Fault Detection on an Autonomous Vehicle. GrC 2007: 548-551
13EET. Y. Lin: Granular Computing and Web Processing: Representing Documents in Polyhedron. GrC 2007: 6
12EEJianchao Han, T. Y. Lin, Jiye Li, Nick Cercone: Constructing Associative Classifiers from Decision Tables. RSFDGrC 2007: 305-313
2005
11EEPriya Baliga, T. Y. Lin: Kolmogorov complexity based automata modeling for intrusion detection. GrC 2005: 387-392
10EEChurn-Jung Liau, T. Y. Lin: Reasoning about relational granulation in modal logics. GrC 2005: 530-534
9EEWesley W. Chu, T. Y. Lin: Introduction. Appl. Intell. 22(1): 7 (2005)
8EEY. F. Yao, B. Njoman, K. H. Chua, T. Y. Lin: New encapsulation development for fine pitch IC devices. Microelectronics Reliability 45(7-8): 1222-1229 (2005)
2004
7EET. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma: The impact of moisture in mold compound preforms on the warpage of PBGA packages. Microelectronics Reliability 44(4): 603-609 (2004)
2003
6EEY. F. Yao, T. Y. Lin, K. H. Chua: Improving the deflection of wire bonds in stacked chip scale package (CSP). Microelectronics Reliability 43(12): 2039-2045 (2003)
5EET. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu: Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. Microelectronics Reliability 43(5): 803-809 (2003)
4EET. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua: Development of the green plastic encapsulation for high density wirebonded leaded packages. Microelectronics Reliability 43(5): 811-817 (2003)
2002
3EET. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai: The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. Microelectronics Reliability 42(3): 375-380 (2002)
2001
2EET. Y. Lin, Vladik Kreinovich: A Special Session on Granular Computing and Interval Computations at the 19th International Conference of the North American Fuzzy Information Processing Society (NAFIPS) Atlanta, Georgia, July 13-15, 2000. Reliable Computing 7(1): 71-72 (2001)
1988
1EET. Y. Lin: Neighborhood systems and relational databases. ACM Conference on Computer Science 1988: 725

Coauthor Index

1Priya Baliga [11]
2Nick Cercone [12]
3J. W. Chai [3] [5]
4Wesley W. Chu [9]
5K. H. Chua [3] [4] [6] [7] [8]
6Simon Chua [5]
7D. Crouthamel [7]
8K. L. Davison [5]
9C. M. Fang [4]
10Jianchao Han [12]
11Vladik Kreinovich [2]
12W. S. Leong [3] [5]
13Jiye Li [12]
14Churn-Jung Liau [10]
15Y. Y. Ma [7]
16Y. Miao [3]
17B. Njoman [7] [8]
18R. Oh [3]
19J. S. Pan [3] [5]
20S. Y. Teo [7]
21W. C. Tjiu [5]
22K. C. Toh [5]
23Jun Xie [14]
24Keming Xie [14] [15]
25Xinying Xu [15]
26Gaowei Yan [14] [15]
27Y. F. Yao [4] [5] [6] [8]
28A. Zadeh [16]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)