T. Y. Lin

2008
16	EE	T. Y. Lin, A. Zadeh: Foreword to the Special Section on Granular Computing. IEEE T. Fuzzy Systems 16(2): 282-284 (2008)
2007
15	EE	Xinying Xu, Gaowei Yan, Keming Xie, T. Y. Lin: Immune Evolution Algorithm Based Dynamic Path Planning Approach for the Soccer Robot. GrC 2007: 477-480
14	EE	Jun Xie, Gaowei Yan, Keming Xie, T. Y. Lin: Neuro-Fuzzy Model-Based CUSUM Method Application in Fault Detection on an Autonomous Vehicle. GrC 2007: 548-551
13	EE	T. Y. Lin: Granular Computing and Web Processing: Representing Documents in Polyhedron. GrC 2007: 6
12	EE	Jianchao Han, T. Y. Lin, Jiye Li, Nick Cercone: Constructing Associative Classifiers from Decision Tables. RSFDGrC 2007: 305-313
2005
11	EE	Priya Baliga, T. Y. Lin: Kolmogorov complexity based automata modeling for intrusion detection. GrC 2005: 387-392
10	EE	Churn-Jung Liau, T. Y. Lin: Reasoning about relational granulation in modal logics. GrC 2005: 530-534
9	EE	Wesley W. Chu, T. Y. Lin: Introduction. Appl. Intell. 22(1): 7 (2005)
8	EE	Y. F. Yao, B. Njoman, K. H. Chua, T. Y. Lin: New encapsulation development for fine pitch IC devices. Microelectronics Reliability 45(7-8): 1222-1229 (2005)
2004
7	EE	T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma: The impact of moisture in mold compound preforms on the warpage of PBGA packages. Microelectronics Reliability 44(4): 603-609 (2004)
2003
6	EE	Y. F. Yao, T. Y. Lin, K. H. Chua: Improving the deflection of wire bonds in stacked chip scale package (CSP). Microelectronics Reliability 43(12): 2039-2045 (2003)
5	EE	T. Y. Lin, K. L. Davison, W. S. Leong, Simon Chua, Y. F. Yao, J. S. Pan, J. W. Chai, K. C. Toh, W. C. Tjiu: Surface topographical characterization of silver-plated film on the wedge bondability of leaded IC packages. Microelectronics Reliability 43(5): 803-809 (2003)
4	EE	T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua: Development of the green plastic encapsulation for high density wirebonded leaded packages. Microelectronics Reliability 43(5): 811-817 (2003)
2002
3	EE	T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai: The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method. Microelectronics Reliability 42(3): 375-380 (2002)
2001
2	EE	T. Y. Lin, Vladik Kreinovich: A Special Session on Granular Computing and Interval Computations at the 19th International Conference of the North American Fuzzy Information Processing Society (NAFIPS) Atlanta, Georgia, July 13-15, 2000. Reliable Computing 7(1): 71-72 (2001)
1988
1	EE	T. Y. Lin: Neighborhood systems and relational databases. ACM Conference on Computer Science 1988: 725

Coauthor Index

1	Priya Baliga	[11]
2	Nick Cercone	[12]
3	J. W. Chai	[3] [5]
4	Wesley W. Chu	[9]
5	K. H. Chua	[3] [4] [6] [7] [8]
6	Simon Chua	[5]
7	D. Crouthamel	[7]
8	K. L. Davison	[5]
9	C. M. Fang	[4]
10	Jianchao Han	[12]
11	Vladik Kreinovich	[2]
12	W. S. Leong	[3] [5]
13	Jiye Li	[12]
14	Churn-Jung Liau	[10]
15	Y. Y. Ma	[7]
16	Y. Miao	[3]
17	B. Njoman	[7] [8]
18	R. Oh	[3]
19	J. S. Pan	[3] [5]
20	S. Y. Teo	[7]
21	W. C. Tjiu	[5]
22	K. C. Toh	[5]
23	Jun Xie	[14]
24	Keming Xie	[14] [15]
25	Xinying Xu	[15]
26	Gaowei Yan	[14] [15]
27	Y. F. Yao	[4] [5] [6] [8]
28	A. Zadeh	[16]

Colors in the list of coauthors