| 2006 |
|---|
| 5 | EE | Baozhen Li,
Emmanuel Yashchin,
Cathryn Christiansen,
Jason Gill,
Ronald Filippi,
Timothy D. Sullivan:
Application of three-parameter lognormal distribution in EM data analysis.
Microelectronics Reliability 46(12): 2049-2055 (2006) |
| 2004 |
|---|
| 4 | EE | Baozhen Li,
Timothy D. Sullivan,
Tom C. Lee,
Dinesh Badami:
Reliability challenges for copper interconnects.
Microelectronics Reliability 44(3): 365-380 (2004) |
| 2003 |
|---|
| 3 | EE | Harry A. Schafft,
Linda M. Head,
Jason Gill,
Timothy D. Sullivan:
Early reliability assessment by using deep censoring.
Microelectronics Reliability 43(1): 1-16 (2003) |
| 1996 |
|---|
| 2 | EE | James F. Ziegler,
Huntington W. Curtis,
Hans P. Muhlfeld,
Charles J. Montrose,
B. Chin,
Michael Nicewicz,
C. A. Russell,
Wen Y. Wang,
Leo B. Freeman,
P. Hosier,
L. E. LaFave,
James L. Walsh,
José M. Orro,
G. J. Unger,
John M. Ross,
Timothy J. O'Gorman,
B. Messina,
Timothy D. Sullivan,
A. J. Sykes,
H. Yourke,
Thomas A. Enger,
Vikram R. Tolat,
T. S. Scott,
Allen H. Taber,
R. J. Sussman,
W. A. Klein,
C. W. Wahaus:
IBM experiments in soft fails in computer electronics (1978-1994).
IBM Journal of Research and Development 40(1): 3-18 (1996) |
| 1995 |
|---|
| 1 | | Chao-Kun Hu,
Kenneth P. Rodbell,
Timothy D. Sullivan,
Kim Y. Lee,
Dennis P. Bouldin:
Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines.
IBM Journal of Research and Development 39(4): 465-498 (1995) |
