| |
| 2003 | ||
|---|---|---|
| 1 | EE | A. Tetelin, C. Pellet, J.-Y. Delétage, B. Carbonne, Y. Danto: Moisture diffusion in BCB resins used for MEMS packaging. Microelectronics Reliability 43(9-11): 1939-1944 (2003) |
| 1 | Y. Danto | [1] |
| 2 | J.-Y. Delétage | [1] |
| 3 | C. Pellet | [1] |
| 4 | A. Tetelin | [1] |