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Hua Lu

University of Greenwich, UK

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2003
2EEC. Y. Yin, M. O. Alam, Y. C. Chan, C. Bailey, Hua Lu: The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability 43(4): 625-633 (2003)
2002
1EEHua Lu, K. C. Hung, S. Stoyanov, C. Bailey, Y. C. Chan: No-flow underfill flip chip assembly--an experimental and modeling analysis. Microelectronics Reliability 42(8): 1205-1212 (2002)

Coauthor Index

1M. O. Alam [2]
2C. Bailey [1] [2]
3Y. C. Chan [1] [2]
4K. C. Hung [1]
5S. Stoyanov [1]
6C. Y. Yin [2]

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