| |
| 2003 | ||
|---|---|---|
| 1 | EE | Kazuto Nishida, Kazumichi Shimizu, Michiro Yoshino, Hideo Koguchi, Nipon Taweejun: Reliability evaluation of ultra-thin CSP using new flip-chip bonding technology--double-sided CSP and single-sided CSP. Microelectronics Reliability 43(12): 2065-2075 (2003) |
| 1 | Hideo Koguchi | [1] |
| 2 | Kazuto Nishida | [1] |
| 3 | Kazumichi Shimizu | [1] |
| 4 | Michiro Yoshino | [1] |