| 2007 |
|---|
| 7 | EE | D. G. Yang,
K. M. B. Jansen,
L. J. Ernst,
G. Q. Zhang,
H. J. L. Bressers,
J. H. J. Janssen:
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds.
Microelectronics Reliability 47(2-3): 233-239 (2007) |
| 6 | EE | C. van't Hof,
K. M. B. Jansen,
G. Wisse,
L. J. Ernst,
D. G. Yang,
G. Q. Zhang,
H. J. L. Bressers:
Novel shear tools for viscoelastic characterization of packaging polymers.
Microelectronics Reliability 47(2-3): 240-247 (2007) |
| 5 | EE | V. Gonda,
K. M. B. Jansen,
L. J. Ernst,
J. den Toonder,
G. Q. Zhang:
Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques.
Microelectronics Reliability 47(2-3): 248-251 (2007) |
| 4 | EE | H. J. L. Bressers,
W. D. van Driel,
K. M. B. Jansen,
L. J. Ernst,
G. Q. Zhang:
Correlation between chemistry of polymer building blocks and microelectronics reliability.
Microelectronics Reliability 47(2-3): 290-294 (2007) |
| 3 | EE | D. G. Yang,
K. M. B. Jansen,
L. J. Ernst,
G. Q. Zhang,
W. D. van Driel,
H. J. L. Bressers,
J. H. J. Janssen:
Numerical modeling of warpage induced in QFN array molding process.
Microelectronics Reliability 47(2-3): 310-318 (2007) |
| 2006 |
|---|
| 2 | EE | C. Yuan,
W. D. van Driel,
R. B. R. van Silfhout,
O. van der Sluis,
R. A. B. Engelen,
L. J. Ernst,
F. van Keulen,
G. Q. Zhang:
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions.
Microelectronics Reliability 46(9-11): 1679-1684 (2006) |
| 2003 |
|---|
| 1 | EE | W. D. van Driel,
G. Q. Zhang,
J. H. J. Janssen,
L. J. Ernst,
F. Su,
Kerm Sin Chian,
Sung Yi:
Prediction and verification of process induced warpage of electronic packages.
Microelectronics Reliability 43(5): 765-774 (2003) |
