| |
| 2006 | ||
|---|---|---|
| 2 | EE | Chi-Hui Chien, Thaiping Chen, Yung-Chang Chen, Yii-Tay Chiou, Chi-Chang Hsieh, Yii-Der Wu: Stability of the warpage in a PBGA package subjected to hygro-thermal loading. Microelectronics Reliability 46(7): 1139-1147 (2006) |
| 2003 | ||
| 1 | EE | Chi-Hui Chien, Yung-Chang Chen, Yii-Tay Chiou, Thaiping Chen, Chi-Chang Hsieh, Jia-Jin Yan, Wei-Zhi Chen, Yii-Der Wu: Influences of the moisture absorption on PBGA package's warpage during IR reflow process. Microelectronics Reliability 43(1): 131-139 (2003) |
| 1 | Thaiping Chen | [1] [2] |
| 2 | Wei-Zhi Chen | [1] |
| 3 | Yung-Chang Chen | [1] [2] |
| 4 | Chi-Hui Chien | [1] [2] |
| 5 | Chi-Chang Hsieh | [1] [2] |
| 6 | Yii-Der Wu | [1] [2] |
| 7 | Jia-Jin Yan | [1] |