| |
| 2005 | ||
|---|---|---|
| 2 | EE | Xiaowu Zhang, E. H. Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao: Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives. Microelectronics Reliability 45(7-8): 1215-1221 (2005) |
| 2003 | ||
| 1 | EE | E. H. Wong, Ranjan Rajoo: Moisture absorption and diffusion characterisation of packaging materials--advanced treatment. Microelectronics Reliability 43(12): 2087-2096 (2003) |
| 1 | J. F. J. M. Caers | [2] |
| 2 | Mahadevan K. Iyer | [2] |
| 3 | E. H. Wong | [1] [2] |
| 4 | Xiaowu Zhang | [2] |
| 5 | X. J. Zhao | [2] |