| 2006 |
|---|
| 4 | EE | E. H. Wong,
Y.-W. Mai:
New insights into board level drop impact.
Microelectronics Reliability 46(5-6): 930-938 (2006) |
| 2005 |
|---|
| 3 | EE | Xiaowu Zhang,
E. H. Wong,
Ranjan Rajoo,
Mahadevan K. Iyer,
J. F. J. M. Caers,
X. J. Zhao:
Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives.
Microelectronics Reliability 45(7-8): 1215-1221 (2005) |
| 2004 |
|---|
| 2 | EE | Xiaowu Zhang,
E. H. Wong,
Charles Lee,
Tai-Chong Chai,
Yiyi Ma,
Poi-Siong Teo,
D. Pinjala,
Srinivasamurthy Sampath:
Thermo-mechanical finite element analysis in a multichip build up substrate based package design.
Microelectronics Reliability 44(4): 611-619 (2004) |
| 2003 |
|---|
| 1 | EE | E. H. Wong,
Ranjan Rajoo:
Moisture absorption and diffusion characterisation of packaging materials--advanced treatment.
Microelectronics Reliability 43(12): 2087-2096 (2003) |
