Cemal Basaran

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4EECemal Basaran, Minghui Lin, Shidong Li: Computational simulation of electromigration induced damage in copper interconnects. SCSC 2007: 261-268
3EECemal Basaran, Juan Gomez, Minghui Lin, Shidong Li: Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging. SCSC 2007: 269-275
2EECemal Basaran, Michael Sellers, David Kofke, Andrew Schultz: Strain energy change due to an atomic defect in solder alloy lattice. SCSC 2007: 37
1EEHua Ye, Douglas C. Hopkins, Cemal Basaran: Measurement of high electrical current density effects in solder joints. Microelectronics Reliability 43(12): 2021-2029 (2003)

Coauthor Index

1Juan Gomez [3]
2Douglas C. Hopkins [1]
3David Kofke [2]
4Shidong Li [3] [4]
5Minghui Lin [3] [4]
6Andrew Schultz [2]
7Michael Sellers [2]
8Hua Ye [1]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)