| 2007 |
|---|
| 4 | EE | Cemal Basaran,
Minghui Lin,
Shidong Li:
Computational simulation of electromigration induced damage in copper interconnects.
SCSC 2007: 261-268 |
| 3 | EE | Cemal Basaran,
Juan Gomez,
Minghui Lin,
Shidong Li:
Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging.
SCSC 2007: 269-275 |
| 2 | EE | Cemal Basaran,
Michael Sellers,
David Kofke,
Andrew Schultz:
Strain energy change due to an atomic defect in solder alloy lattice.
SCSC 2007: 37 |
| 2003 |
|---|
| 1 | EE | Hua Ye,
Douglas C. Hopkins,
Cemal Basaran:
Measurement of high electrical current density effects in solder joints.
Microelectronics Reliability 43(12): 2021-2029 (2003) |
