| |
| 2006 | ||
|---|---|---|
| 2 | EE | W. Dauksher, P. Marcoux, G. Castleman: A methodology for the calculation of stress migration in die-level interconnects. Microelectronics Reliability 46(2-4): 616-625 (2006) |
| 2003 | ||
| 1 | EE | W. Dauksher, W. S. Burton: An examination of the applicability of the DNP metric on first level reliability assessments in underfilled electronic packages. Microelectronics Reliability 43(12): 2011-2020 (2003) |
| 1 | W. S. Burton | [1] |
| 2 | G. Castleman | [2] |
| 3 | P. Marcoux | [2] |