J. Bielen

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2003

1 EE N. Duan, J. Scheer, J. Bielen, M. van Kleef: The influence of Sn-Cu-Ni(Au) and Sn-Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates. Microelectronics Reliability 43(8): 1317-1327 (2003)

2003
1	EE	N. Duan, J. Scheer, J. Bielen, M. van Kleef: The influence of Sn-Cu-Ni(Au) and Sn-Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates. Microelectronics Reliability 43(8): 1317-1327 (2003)

Coauthor Index

1 N. Duan [1]

2 M. van Kleef [1]

3 J. Scheer [1]