| 2007 |
|---|
| 19 | EE | Yuki Fukuda,
Michael D. Osterman,
Michael G. Pecht:
The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth.
Microelectronics Reliability 47(1): 88-92 (2007) |
| 2006 |
|---|
| 18 | EE | Mohammadreza Keimasi,
Sanka Ganesan,
Michael G. Pecht:
Low temperature electrical measurements of silicon bipolar monolithic microwave integrated circuit (MMIC) amplifiers.
Microelectronics Reliability 46(2-4): 326-334 (2006) |
| 17 | EE | Sanka Ganesan,
Michael G. Pecht,
Sharon Ling:
Use of high temperature operating life data to mitigate risks in long-duration space applications that deploy commercial-grade plastic encapsulated semiconductor devices.
Microelectronics Reliability 46(2-4): 360-366 (2006) |
| 16 | EE | Daniel N. Donahoe,
Michael G. Pecht,
Isabel K. Lloyd,
Sanka Ganesan:
Moisture induced degradation of multilayer ceramic capacitors.
Microelectronics Reliability 46(2-4): 400-408 (2006) |
| 15 | EE | Tong Fang,
Michael D. Osterman,
Michael G. Pecht:
Statistical analysis of tin whisker growth.
Microelectronics Reliability 46(5-6): 846-849 (2006) |
| 2004 |
|---|
| 14 | EE | Jingsong Xie,
Michael G. Pecht:
Contact discontinuity modeling of electromechanical switches.
IEEE Transactions on Reliability 53(2): 279-283 (2004) |
| 13 | EE | Arun Ramakrishnan,
Michael G. Pecht:
Load characterization during transportation.
Microelectronics Reliability 44(2): 333-338 (2004) |
| 2003 |
|---|
| 12 | EE | C. Hillman,
B. Castillo,
Michael G. Pecht:
Diffusion and absorption of corrosive gases in electronic encapsulants.
Microelectronics Reliability 43(4): 635-643 (2003) |
| 11 | EE | Ping Zhao,
Michael G. Pecht:
Field failure due to creep corrosion on components with palladium pre-plated leadframes.
Microelectronics Reliability 43(5): 775-783 (2003) |
| 2002 |
|---|
| 10 | EE | Ricky Valentin,
Jeremy Cunningham,
Michael D. Osterman,
Abhijit Dasgupta II,
Michael G. Pecht,
Dinos Tsagos:
Weapon and communication systems: virtual life assessment of electronic hardware used in the Advanced Amphibious Assault Vehicle (AAAV).
Winter Simulation Conference 2002: 948-953 |
| 9 | EE | Ninoslav Stojadinovic,
Michael G. Pecht:
Editorial.
Microelectronics Reliability 42(4-5): 463 (2002) |
| 8 | EE | Dawn A. Thomas,
Ken Ayers,
Michael G. Pecht:
The "trouble not identified" phenomenon in automotive electronics.
Microelectronics Reliability 42(4-5): 641-651 (2002) |
| 7 | EE | Leon Lantz,
Seongdeok Hwang,
Michael G. Pecht:
Characterization of plastic encapsulant materials as a baseline for quality assessment and reliability testing.
Microelectronics Reliability 42(8): 1163-1170 (2002) |
| 6 | EE | Michael G. Pecht,
Diganta Das,
Arun Ramakrishnan:
The IEEE standards on reliability program and reliability prediction methods for electronic equipment.
Microelectronics Reliability 42(9-11): 1259-1266 (2002) |
| 2001 |
|---|
| 5 | EE | Ninoslav Stojadinovic,
Michael G. Pecht:
Editorial.
Microelectronics Reliability 41(1): 1 (2001) |
| 4 | EE | Bharatwaj Ramakrishnan,
Peter Sandborn,
Michael G. Pecht:
Process capability indices and product reliability.
Microelectronics Reliability 41(12): 2067-2070 (2001) |
| 3 | EE | Jingsong Xie,
Michael G. Pecht,
David DeDonato,
Ali Hassanzadeh:
An investigation of the mechanical behavior of conductive elastomer interconnects.
Microelectronics Reliability 41(2): 281-286 (2001) |
| 2 | EE | Ninoslav Stojadinovic,
Michael G. Pecht:
In memory of D. Stewart Peck.
Microelectronics Reliability 41(4): 481 (2001) |
| 1990 |
|---|
| 1 | EE | Michael D. Osterman,
Michael G. Pecht:
Placement for reliability and routability of convectively cooled PWBs.
IEEE Trans. on CAD of Integrated Circuits and Systems 9(7): 734-744 (1990) |
